18158389. METHODS AND SYSTEMS FOR MODULAR TRANSDUCER PROBE WITH REDUCED FOOTPRINT simplified abstract (GE PRECISION HEALTHCARE LLC)
Contents
METHODS AND SYSTEMS FOR MODULAR TRANSDUCER PROBE WITH REDUCED FOOTPRINT
Organization Name
Inventor(s)
Warren Lee of Niskayuna NY (US)
Jean-Luc Diot of Valbonne (FR)
Giandonato Stallone of Valbonne (FR)
Naresh K Rao of Niskayuna NY (US)
METHODS AND SYSTEMS FOR MODULAR TRANSDUCER PROBE WITH REDUCED FOOTPRINT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18158389 titled 'METHODS AND SYSTEMS FOR MODULAR TRANSDUCER PROBE WITH REDUCED FOOTPRINT
The abstract describes an electro-acoustic module for a transducer probe, featuring an acoustic stack and an application-specific integrated circuit (ASIC) connected by a fan-out architecture.
- The electro-acoustic module has an active aperture equal to its overall size in at least one direction.
- The ASIC is electrically coupled to the acoustic stack, enhancing the performance of the transducer probe.
- The interconnect design with a fan-out architecture ensures efficient electrical connections within the module.
- The module can be configured to have an active aperture in both azimuth and elevation directions.
- The technology aims to improve the functionality and performance of transducer probes in various applications.
Potential Applications: - Medical imaging devices - Industrial testing equipment - Underwater sonar systems
Problems Solved: - Enhanced performance and functionality of transducer probes - Improved signal processing capabilities - Increased accuracy in acoustic measurements
Benefits: - Higher resolution imaging - Greater sensitivity in acoustic detection - Enhanced overall performance of transducer probes
Commercial Applications: Title: Advanced Electro-Acoustic Modules for Transducer Probes This technology can be utilized in medical imaging equipment, industrial testing devices, and underwater exploration systems, offering improved accuracy and performance in acoustic measurements.
Questions about Electro-Acoustic Modules for Transducer Probes: 1. How does the fan-out architecture improve the electrical connections within the electro-acoustic module? 2. What are the potential advantages of having an active aperture equal to the overall size of the module?
Original Abstract Submitted
Various methods and systems are provided for an electro-acoustic module for a transducer probe. In one example, the electro-acoustic module may include an acoustic stack and at least one application-specific integrated circuit (ASIC) electrically coupled to the acoustic stack by an interconnect having a fan-out architecture. The electro-acoustic module may have an active aperture substantially equal to an overall size of the electro-acoustic module in at least one or an azimuth and an elevation direction.
