18595281. MICROELECTRONIC DEVICES WITH ISOLATION TRENCHES IN UPPER PORTIONS OF TIERED STACKS, AND RELATED METHODS simplified abstract (Lodestar Licensing Group LLC)
MICROELECTRONIC DEVICES WITH ISOLATION TRENCHES IN UPPER PORTIONS OF TIERED STACKS, AND RELATED METHODS
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MICROELECTRONIC DEVICES WITH ISOLATION TRENCHES IN UPPER PORTIONS OF TIERED STACKS, AND RELATED METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18595281 titled 'MICROELECTRONIC DEVICES WITH ISOLATION TRENCHES IN UPPER PORTIONS OF TIERED STACKS, AND RELATED METHODS
The patent application describes methods for forming microelectronic devices by creating lower and upper stack structures with alternating insulative and other structures. Pillar structures are formed to extend through these stack structures, with conductive structures replacing some of the other structures to create select gate structures. A slit is then formed through both stack structures, with additional conductive structures formed in the lower stack structure to create access lines.
- Lower and upper stack structures with alternating insulative and other structures are formed.
- Pillar structures extend through the stack structures.
- Conductive structures replace some other structures in the upper stack to create select gate structures.
- A slit is formed through both stack structures.
- Additional conductive structures are formed in the lower stack to create access lines.
Potential Applications: - Microelectronic devices - Electronic systems - Semiconductor manufacturing
Problems Solved: - Efficient formation of microelectronic devices - Improved conductivity in select gate and access line structures
Benefits: - Enhanced performance of microelectronic devices - Increased efficiency in semiconductor manufacturing processes
Commercial Applications: Title: Semiconductor Manufacturing Innovation for Microelectronic Devices This technology can be applied in the production of various microelectronic devices, improving their performance and reliability. It has the potential to revolutionize the semiconductor industry by streamlining manufacturing processes and enhancing device functionality.
Questions about Semiconductor Manufacturing Innovation for Microelectronic Devices: 1. How does this technology impact the efficiency of semiconductor manufacturing processes? This technology improves the efficiency of semiconductor manufacturing by optimizing the formation of microelectronic devices, resulting in enhanced performance and reliability.
2. What are the potential applications of this innovation in the field of electronic systems? This innovation can be applied in various electronic systems to improve their functionality and performance, making them more reliable and efficient.
Original Abstract Submitted
Methods for forming microelectronic devices include forming lower and upper stack structures, each comprising vertically alternating sequences of insulative and other structures arranged in tiers. Lower and upper pillar structures are formed to extend through the lower and upper stack structures, respectively. An opening is formed through the upper stack structure, and at least a portion of the other structures of the upper stack are replaced by (e.g., chemically converted into) conductive structures, which may be configured as select gate structures. Subsequently, a slit is formed, extending through both the upper and lower stack structures, and at least a portion of the other structures of the lower stack structure are replaced by a conductive material within a liner to form additional conductive structures, which may be configured as access lines (e.g., word lines). Microelectronic devices and structures and related electronic systems are also disclosed.
