18099056. SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
Contents
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Advanced Semiconductor Engineering, Inc.
Inventor(s)
Yu-Chang Chen of Kaohsiung (TW)
Wei-Tung Chang of Kaohsiung (TW)
Jen-Chieh Kao of Kaohsiung (TW)
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18099056 titled 'SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation: The semiconductor device package described in the patent application consists of a substrate, an electronic component, an intermediate structure, and a protective layer. The electronic component is placed on the substrate, with the intermediate structure, including an interposer and a conductive element, on top of it. The protective layer covers the electronic component and the upper surface of the conductive element.
- The semiconductor device package includes a substrate, electronic component, intermediate structure, and protective layer.
- The electronic component is positioned on the substrate, with the intermediate structure comprising an interposer and a conductive element.
- A protective layer covers the electronic component and the upper surface of the conductive element.
Key Features and Innovation:
- Integration of an interposer and a conductive element in the intermediate structure.
- Protective layer covering the electronic component and the upper surface of the conductive element.
Potential Applications: This technology can be used in various semiconductor devices, such as microprocessors, memory modules, and integrated circuits.
Problems Solved:
- Protection of the electronic component and the conductive element.
- Enhanced durability and reliability of semiconductor devices.
Benefits:
- Improved performance and longevity of semiconductor devices.
- Enhanced protection against external factors.
Commercial Applications: Potential commercial applications include the manufacturing of advanced electronic devices for consumer electronics, automotive systems, and industrial equipment.
Prior Art: Further research can be conducted in the field of semiconductor packaging technologies to explore similar innovations and advancements.
Frequently Updated Research: Researchers are constantly working on improving semiconductor packaging techniques to enhance the efficiency and reliability of electronic devices.
Questions about Semiconductor Device Package: 1. What are the key components of the semiconductor device package described in the patent application? 2. How does the protective layer contribute to the overall functionality of the semiconductor device package?
Original Abstract Submitted
A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a substrate, an electronic component, an intermediate structure and a protective layer. The electronic component is disposed over the substrate. The intermediate structure is disposed over the substrate and comprises an interposer and a conductive element on the interposer. The protective layer is disposed over the substrate and has an upper surface covering the electronic component and being substantially level with an upper surface of the conductive element.
