18099867. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR FLATTENING WORKPIECE simplified abstract (Advanced Semiconductor Engineering, Inc.)

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METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR FLATTENING WORKPIECE

Organization Name

Advanced Semiconductor Engineering, Inc.

Inventor(s)

Ya Fang Chan of Kaohsiung (TW)

Cong-Wei Chen of Kaohsiung (TW)

Kuoching Cheng of Kaohsiung (TW)

Shih-Yu Wang of Kaohsiung (TW)

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR FLATTENING WORKPIECE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18099867 titled 'METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR FLATTENING WORKPIECE

The abstract describes a method for manufacturing a semiconductor package and an apparatus for flattening a workpiece. The method involves applying a force to different regions of a panel to flatten it over a stage.

  • The method involves providing a panel with a lower surface facing the stage and an upper surface, applying a force to flatten the panel.
  • The force is applied from one region of the upper surface towards the stage and transferred to another region to achieve flattening.
  • This process helps in manufacturing semiconductor packages efficiently and accurately.

Potential Applications: - Semiconductor manufacturing industry - Electronics packaging industry - Automated manufacturing processes

Problems Solved: - Ensuring flatness of semiconductor packages - Improving manufacturing precision and efficiency

Benefits: - Enhanced quality of semiconductor packages - Increased productivity in manufacturing processes - Cost-effective production methods

Commercial Applications: Title: "Advanced Semiconductor Packaging Manufacturing Method" This technology can be utilized in the semiconductor manufacturing industry to improve the quality and efficiency of packaging processes. It can also be integrated into automated manufacturing systems for increased productivity.

Questions about the technology: 1. How does this method compare to traditional semiconductor packaging manufacturing processes? - This method offers improved precision and efficiency compared to traditional processes by utilizing force distribution to flatten the workpiece effectively. 2. What are the potential cost savings associated with implementing this technology in semiconductor packaging manufacturing? - Implementing this technology can lead to cost savings by reducing material waste and improving production efficiency.


Original Abstract Submitted

A method for manufacturing a semiconductor package and an apparatus for flattening a workpiece are provided. The method includes providing a panel over a stage, wherein the panel includes a lower surface facing the stage and an upper surface opposite to the lower surface; applying a first force to a first region of the upper surface of the panel along at least one direction from the panel toward the stage; and transferring the first force from the first region to a second region of the upper surface of the panel different from the first region.

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