18627723. BACKSIDE ILLUMINATION IMAGE SENSOR AND IMAGE-CAPTURING DEVICE simplified abstract (Nikon Corporation)
Contents
BACKSIDE ILLUMINATION IMAGE SENSOR AND IMAGE-CAPTURING DEVICE
Organization Name
Inventor(s)
Yosuke Kusaka of Yokohama-shi (JP)
BACKSIDE ILLUMINATION IMAGE SENSOR AND IMAGE-CAPTURING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18627723 titled 'BACKSIDE ILLUMINATION IMAGE SENSOR AND IMAGE-CAPTURING DEVICE
The abstract describes a backside illumination image sensor with photoelectric conversion elements and a read circuit on the front surface of the semiconductor substrate, capturing images by outputting electrical signals generated from incident light reaching the back surface.
- Light shielding film with openings for incident light to enter the photoelectric conversion elements.
- On-chip lens positioned at a predetermined distance from the light shielding film for each photoelectric conversion element.
- Conjugate relation between the light shielding film and the exit pupil plane of the image forming optical system with respect to the on-chip lens.
Potential Applications: - Digital cameras - Smartphones - Surveillance systems - Medical imaging devices
Problems Solved: - Improved image quality - Enhanced sensitivity to light - Reduction of noise in captured images
Benefits: - Higher quality images - Better low-light performance - Compact design
Commercial Applications: Title: Advanced Image Sensors for High-Performance Cameras This technology can be used in high-end digital cameras, smartphones, and other imaging devices to improve image quality and performance, catering to professional photographers and photography enthusiasts.
Questions about Backside Illumination Image Sensor Technology: 1. How does the on-chip lens improve image quality in the sensor? The on-chip lens helps focus light onto the photoelectric conversion elements, enhancing the sensor's sensitivity and overall image quality.
2. What are the key advantages of using a backside illumination image sensor? Backside illumination image sensors offer better light sensitivity, reduced noise, and improved performance in low-light conditions compared to traditional front-illuminated sensors.
Original Abstract Submitted
A backside illumination image sensor that includes a semiconductor substrate with a plurality of photoelectric conversion elements and a read circuit formed on a front surface side of the semiconductor substrate, and captures an image by outputting, via the read circuit, electrical signals generated as incident light having reached a back surface side of the semiconductor substrate is received at the photoelectric conversion elements includes: a light shielding film formed on a side where incident light enters the photoelectric conversion elements, with an opening formed therein in correspondence to each photoelectric conversion element; and an on-chip lens formed at a position set apart from the light shielding film by a predetermined distance in correspondence to each photoelectric conversion element. The light shielding film and an exit pupil plane of the image forming optical system achieve a conjugate relation to each other with regard to the on-chip lens.
