18627195. CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOLING APPLICATIONS simplified abstract (Hewlett Packard Enterprise Development LP)

CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOLING APPLICATIONS

Organization Name

Hewlett Packard Enterprise Development LP

Inventor(s)

Ernesto Ferrer Medina of Aguadilla (PR)

Harvey J. Lunsman of Chippewa Falls WI (US)

Tahir Cader of Liberty Lake WA (US)

John Franz of Houston TX (US)

CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOLING APPLICATIONS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18627195 titled 'CONFORMING HEAT TRANSPORT DEVICE FOR DUAL INLINE MEMORY MODULE COOLING APPLICATIONS

Simplified Explanation

The patent application describes a circuit board cooling apparatus that includes a heat spreader device, a conforming heat transfer device, and a heat transport device to efficiently cool the circuit board.

• The cooling apparatus has a heat spreader device that is thermally coupled with the circuit board's surface.
• A conforming heat transfer device is physically and thermally coupled with the heat spreader device to match its surface contour.
• A heat transport device is attached and thermally coupled with the heat transfer device to effectively dissipate heat from the circuit board.

Key Features and Innovation

• Utilizes a heat spreader device to efficiently transfer heat from the circuit board.
• Incorporates a conforming heat transfer device to match the surface contour of the heat spreader device.
• Includes a heat transport device to effectively dissipate heat from the circuit board.

Potential Applications

The technology can be applied in various electronic devices and systems that require efficient cooling, such as computers, servers, and industrial equipment.

Problems Solved

• Improves thermal management of circuit boards.
• Enhances overall performance and reliability of electronic devices.
• Reduces the risk of overheating and component failure.

Benefits

• Efficient cooling of circuit boards.
• Improved performance and reliability of electronic devices.
• Reduced risk of overheating and damage to components.

Commercial Applications

• Title: "Advanced Circuit Board Cooling Technology for Enhanced Performance"
• Potential commercial uses include computer systems, servers, telecommunications equipment, and industrial machinery.
• Market implications include improved product reliability, reduced maintenance costs, and increased customer satisfaction.

Questions about Circuit Board Cooling Technology

How does the conforming heat transfer device improve cooling efficiency?

The conforming heat transfer device matches the surface contour of the heat spreader device, ensuring maximum contact for efficient heat dissipation.

What are the potential long-term benefits of implementing this cooling technology in electronic devices?

Implementing this cooling technology can lead to improved device performance, extended lifespan, and reduced maintenance costs over time.

Original Abstract Submitted

A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.