18409377. CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE simplified abstract (Shin-Etsu Chemical Co., Ltd.)
CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Yoshihiro Tsutsumi of Annaka-shi (JP)
Masayuki Iwasaki of Annaka-shi (JP)
CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18409377 titled 'CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE
The curable maleimide resin composition described in the patent application does not require the use of aprotic polar solvents like NMP and can be cured at temperatures below 250°C, which is lower than the curing temperature of normal polyimides. This composition can produce a cured product with excellent adhesiveness to copper.
- Does not use aprotic polar solvents like NMP
- Can be cured at temperatures below 250°C
- Superior adhesiveness to copper
- Cured product with enhanced properties
- Lower curing temperature compared to traditional polyimides
Potential Applications: - Electronics industry for circuit board manufacturing - Aerospace industry for composite materials - Automotive industry for high-performance parts
Problems Solved: - Eliminates the need for toxic solvents - Reduces energy consumption during curing process - Improves adhesion properties to copper substrates
Benefits: - Environmentally friendly - Cost-effective manufacturing process - Enhanced product performance - Wide range of applications in various industries
Commercial Applications: Title: Advanced Maleimide Resin for Enhanced Adhesion in Electronics Manufacturing This technology can be utilized in the production of electronic components, aerospace materials, and automotive parts, offering superior adhesion properties and improved performance.
Prior Art: Readers can explore prior research on maleimide resin compositions, adhesion properties in polymers, and alternative curing methods for polyimides to gain a deeper understanding of the innovation presented in this patent application.
Frequently Updated Research: Researchers are continuously exploring new formulations and curing techniques for maleimide resins to enhance their properties and expand their applications in different industries.
Questions about Curable Maleimide Resin Composition: 1. How does the absence of aprotic polar solvents impact the curing process of the resin? 2. What are the key factors that contribute to the superior adhesiveness of the cured product to copper substrates?
Original Abstract Submitted
Provided are a curable maleimide resin composition and others, in which the curable maleimide resin composition is one that does not employ an aprotic polar solvent such as NMP, can be cured at a temperature lower than 250° ° C. which is a temperature at which a normal polyimide cures, and can particularly be turned into a cured product having a superior adhesiveness to copper. The curable maleimide resin composition contains:
