18625401. ORGANIC VAPOR JET PRINTING SYSTEM simplified abstract (Universal Display Corporation)

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ORGANIC VAPOR JET PRINTING SYSTEM

Organization Name

Universal Display Corporation

Inventor(s)

Gregory Mcgraw of Yardley PA (US)

William E. Quinn of Whitehouse Station NJ (US)

Gregg Kottas of Ewing NJ (US)

Siddharth Harikrishna Mohan of Plainsboro NJ (US)

Matthew King of Moorestown NJ (US)

ORGANIC VAPOR JET PRINTING SYSTEM - A simplified explanation of the abstract

This abstract first appeared for US patent application 18625401 titled 'ORGANIC VAPOR JET PRINTING SYSTEM

The patent application describes systems and techniques for depositing organic material on a substrate while preventing contamination by the chamber ambient through the use of shield gas flows.

  • Multiple layers of the same or different materials can be deposited in a single deposition chamber without the need to move between different chambers.
  • Reduced chance of cross-contamination between layers is achieved.
  • Shield gas flows play a crucial role in preventing contamination of the substrate by the chamber ambient.

Potential Applications: - Semiconductor manufacturing - Thin film deposition - Solar cell production

Problems Solved: - Cross-contamination between layers during deposition - Need for movement between different deposition chambers

Benefits: - Increased efficiency in material deposition - Improved quality of deposited layers - Cost savings by eliminating the need for multiple deposition chambers

Commercial Applications: Organic material deposition systems can be used in various industries such as electronics, optics, and renewable energy for efficient and precise material deposition processes.

Questions about Organic Material Deposition Systems: 1. How do shield gas flows prevent contamination of the substrate during material deposition?

  - Shield gas flows create a barrier between the substrate and the chamber ambient, preventing contamination during the deposition process.

2. What are the key advantages of depositing multiple layers of materials in a single deposition chamber?

  - Depositing multiple layers in one chamber reduces the risk of cross-contamination and simplifies the deposition process, leading to cost savings and improved efficiency.


Original Abstract Submitted

Systems and techniques for depositing organic material on a substrate are provided, in which one or more shield gas flows prevents contamination of the substrate by the chamber ambient. Thus, multiple layers of the same or different materials may be deposited in a single deposition chamber, without the need for movement between different deposition chambers, and with reduced chance of cross-contamination between layers.