18521973. MULTI-CHIP MULTI-CHANNEL BEAMFORMER MODULE WITH INTERPOSER PASSIVES simplified abstract (SKYWORKS SOLUTIONS, INC.)
Contents
MULTI-CHIP MULTI-CHANNEL BEAMFORMER MODULE WITH INTERPOSER PASSIVES
Organization Name
Inventor(s)
Siva Viswanathan Thyagarajan of San Jose CA (US)
Stephen Joseph Kovacic of Newport Beach CA (US)
MULTI-CHIP MULTI-CHANNEL BEAMFORMER MODULE WITH INTERPOSER PASSIVES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18521973 titled 'MULTI-CHIP MULTI-CHANNEL BEAMFORMER MODULE WITH INTERPOSER PASSIVES
The abstract describes a packaged module with multiple interposer layers containing an array of transmit and/or receive elements, each partitioned into high-performance and low-performance functionality blocks to enable multi-channel beamforming.
- Packaged module with interposer layers
- Array of transmit and/or receive elements
- Elements partitioned into high-performance and low-performance blocks
- Enables multi-channel beamforming functionality
Potential Applications: - Telecommunications - Radar systems - Satellite communication - Autonomous vehicles - Medical imaging
Problems Solved: - Enhanced performance in beamforming - Efficient utilization of resources - Improved signal processing capabilities
Benefits: - Increased signal accuracy - Enhanced data transmission speeds - Improved overall system efficiency
Commercial Applications: - 5G technology development - Radar system upgrades - Satellite communication advancements - Medical imaging equipment enhancements
Questions about the technology: 1. How does the partitioning of transmit/receive elements into high-performance and low-performance blocks improve beamforming functionality? 2. What are the potential cost implications of implementing this technology in various industries?
Frequently Updated Research: - Ongoing studies on optimizing beamforming techniques - Research on improving signal processing algorithms for multi-channel systems
Original Abstract Submitted
In some embodiments, a packaged module can include a packaging substrate having a plurality of interposer layers, and an array of transmit and/or receive elements implemented on a respective interposer layer, each transmit/receive element partitioned into a first block configured to provide high-performance functionality, and a second block configured to provide digitally-intensive low-performance functionality, the first and second blocks in combination configured to provide multi-channel beamforming functionality.
