17704676. SLURRY SUPPLY DEVICE, SUBSTRATE POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SLURRY SUPPLY DEVICE, SUBSTRATE POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

SEUNGCHUL Lee of HWASEONG-SI (KR)

DONGIL Kim of HWASEONG-SI (KR)

HYUNJOON Park of SUWON-SI (KR)

KIJU Sohn of GUNPO-SI (KR)

JONGHUN Pi of GUNWI-GUN (KR)

SLURRY SUPPLY DEVICE, SUBSTRATE POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 17704676 titled 'SLURRY SUPPLY DEVICE, SUBSTRATE POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD

Simplified Explanation

The abstract describes a slurry supply device that consists of a slurry distribution part and a support part. The slurry distribution part includes a guide bar with a slot, a distribution bar inserted into the slot, and a slurry delivery member.

  • The slurry distribution part dispenses slurry, while the support part provides support for the distribution part.
  • The guide bar has a slot that extends in a first direction.
  • The distribution bar is inserted into the slot and has a distribution channel that also extends in the first direction.
  • The distribution channel is recessed upwardly from the bottom surface of the distribution bar.
  • The slurry delivery member is responsible for delivering the slurry to the distribution channel.

Potential applications of this technology:

  • Slurry supply devices can be used in various industries that require the dispensing of slurry, such as construction, mining, and manufacturing.
  • It can be utilized in processes that involve coating, polishing, or grinding surfaces with slurry-based materials.
  • The device can be integrated into automated systems for efficient and precise slurry distribution.

Problems solved by this technology:

  • The slurry supply device provides a controlled and efficient way of dispensing slurry, ensuring uniform distribution.
  • The recessed distribution channel prevents slurry from overflowing or spilling during the dispensing process.
  • The support part ensures stability and prevents any potential damage to the slurry distribution part.

Benefits of this technology:

  • The slurry supply device improves the accuracy and consistency of slurry distribution, leading to better quality results.
  • It reduces waste and minimizes the risk of slurry spills or accidents.
  • The device is easy to use and can be integrated into existing systems or processes without significant modifications.


Original Abstract Submitted

A slurry supply device includes; a slurry distribution part configured to dispense slurry, and a support part connected to the slurry distribution part and configured to support the slurry distribution part. The slurry distribution part includes; a guide bar including a slot extending in a first direction, a distribution bar inserted into the slot and including a distribution channel extending in the first direction, the distribution channel being recessed upwardly from a bottom surface of the distribution bar, and a slurry delivery member configured to deliver slurry to the distribution channel.

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