17446405. RESISTOR WITHIN A VIA simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
RESISTOR WITHIN A VIA
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
RESISTOR WITHIN A VIA - A simplified explanation of the abstract
This abstract first appeared for US patent application 17446405 titled 'RESISTOR WITHIN A VIA
Simplified Explanation
The patent application describes a method for forming a via in a semiconductor device using semiconductor processing tools. The method involves several steps, including depositing a metal plug, an oxide-based layer, a resistor, and landing pads on the resistor. Finally, metal plugs are deposited on the landing pads.
- The patent application describes a method for forming a via in a semiconductor device.
- Semiconductor processing tools are used to deposit a metal plug within the via.
- An oxide-based layer is then deposited on the metal plug within the via.
- A resistor is deposited on the oxide-based layer within the via.
- Landing pads are deposited on the resistor within the via.
- Metal plugs are deposited on the landing pads.
Potential Applications
- This technology can be used in the manufacturing of semiconductor devices.
- It can be applied in various industries that utilize semiconductor devices, such as electronics, telecommunications, and automotive.
Problems Solved
- The method provides a reliable and efficient way to form a via in a semiconductor device.
- It ensures proper deposition of the metal plug, oxide-based layer, resistor, and landing pads within the via.
Benefits
- The method allows for precise and controlled formation of vias in semiconductor devices.
- It enables the integration of resistors and landing pads within the via, reducing the need for additional components.
- The technology improves the overall performance and functionality of semiconductor devices.
Original Abstract Submitted
In some implementations, one or more semiconductor processing tools may form a via for a semiconductor device. The one or more semiconductor processing tools may deposit a metal plug within the via. The one or more semiconductor processing tools may deposit an oxide-based layer on the metal plug within the via. The one or more semiconductor processing tools may deposit a resistor on the oxide-based layer within the via. The one or more semiconductor processing tools may deposit a first landing pad and a second landing pad on the resistor within the via. The one or more semiconductor processing tools may deposit a first metal plug on the first landing pad and a second metal plug on the second landing pad.