Category:Xiaopeng WU

Xiaopeng WU

Executive Summary

Xiaopeng WU is an inventor who has filed 5 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), {Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads ( (2 patents), and they have worked with companies such as ROHM CO., LTD. (5 patents). Their most frequent collaborators include (3 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L25/072 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 2 patents
• H01L23/49844 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L23/49575 (Lead-frames {or other flat leads (): 2 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/40 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49568 (Lead-frames {or other flat leads (): 1 patents
• H01L24/30 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49562 (Lead-frames {or other flat leads (): 1 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/30181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29639 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83447 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40137 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73221 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3736 ({Metallic materials (): 1 patents
• H01L2224/48247 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48472 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32257 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/13091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01029 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01013 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• ROHM CO., LTD.: 5 patents

Collaborators

• Kohei TANIKAWA (3 collaborations)
• Hiroto SAKAI (1 collaborations)
• Yuta OKAWAUCHI (1 collaborations)
• Ryosuke FUKUDA (1 collaborations)
• Oji SATO (1 collaborations)