17937487. SPIN COATER AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SPIN COATER AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

MYUNG-SOO Hwang of Seoul (KR)

KWANGSUB Yoon of Yongin-si (KR)

SPIN COATER AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17937487 titled 'SPIN COATER AND SEMICONDUCTOR FABRICATION METHOD USING THE SAME

Simplified Explanation

The abstract describes a spin coater used in semiconductor fabrication, which includes a spin chuck, a nozzle, a nozzle housing, a purge gas supply, and an organic solvent supply. The nozzle housing consists of a lower housing with a solvent storage groove and an upper housing with a nozzle insert hole and a gas supply hole.

  • The spin coater is used in the process of semiconductor fabrication.
  • It includes a spin chuck, nozzle, nozzle housing, purge gas supply, and organic solvent supply.
  • The nozzle housing has a lower housing with a solvent storage groove and an upper housing with a nozzle insert hole and a gas supply hole.
  • The organic solvent is stored in the solvent storage groove.
  • The nozzle is inserted into the nozzle insert hole and connected to the gas supply hole.
  • The spin coater is used to apply a thin layer of organic solvent onto a semiconductor wafer.
  • The purge gas supply is used to remove excess solvent from the wafer surface.

Potential Applications

  • Semiconductor fabrication processes
  • Thin film deposition

Problems Solved

  • Efficient and controlled application of organic solvent onto semiconductor wafers
  • Removal of excess solvent from the wafer surface

Benefits

  • Improved quality and consistency of semiconductor fabrication
  • Reduced waste of organic solvent
  • Increased efficiency in the fabrication process


Original Abstract Submitted

Systems and methods for semiconductor fabrication are described. A spin coater comprises a spin chuck, a nozzle, a nozzle housing, a purge gas supply, and an organic solvent supply. The nozzle housing includes a lower housing including a solvent storage groove in which the organic solvent is stored, and an upper housing on the lower housing. The upper housing includes a nozzle insert hole on the solvent storage groove and receives the nozzle, and a gas supply hole connected to one side of the nozzle insert hole.

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