ELECTRONIC DEVICE INCLUDING SOUND COMPONENT ASSEMBLY

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ELECTRONIC DEVICE INCLUDING SOUND COMPONENT ASSEMBLY - A simplified explanation of the abstract

This abstract first appeared for US patent application 17888889 titled 'ELECTRONIC DEVICE INCLUDING SOUND COMPONENT ASSEMBLY

Simplified Explanation

The patent application describes a sound component assembly for an electronic device with a sound module. It includes a sealing portion that surrounds a portion of the sound passage and contacts the printed circuit board (PCB) with the sound module. There is also a cover portion facing the PCB outside the sealing portion.

The sealing portion is made of a first material, while the cover portion is made of a second material with a higher hardness.
The sound component assembly is designed to provide a seal around the sound passage and protect the PCB and sound module.
The use of different materials with varying hardness helps to ensure the durability and longevity of the assembly.

Potential Applications

This technology can be applied in various electronic devices that require sound components, such as smartphones, tablets, laptops, and audio devices.
It can be used in industrial equipment, automotive systems, and any other devices that require sound modules and protection.

Problems Solved

The sound component assembly solves the problem of protecting the PCB and sound module from external elements, such as dust, moisture, and physical damage.
It also addresses the need for a reliable seal around the sound passage to maintain sound quality and prevent any interference.

Benefits

The use of a sealing portion and cover portion ensures a secure and effective seal, protecting the PCB and sound module from potential damage.
The different materials with varying hardness provide enhanced durability and longevity to the assembly.
The sound component assembly helps to maintain the sound quality and performance of the electronic device.

Original Abstract Submitted

A sound component assembly includes: a sealing portion provided in a sound passage connected to a sound hole of an electronic device to surround a portion of the sound passage and contact at least a portion of a printed circuit board (PCB) having a sound module mounted thereon; and a cover portion disposed to face the PCB outside the sealing portion, wherein the sealing portion may include a first material, the cover portion may include a second material, and the second material may have a greater hardness than a hardness of the first material.