Danfoss Silicon Power GmbH Patent Application Trends in 2024
Danfoss Silicon Power GmbH Patent Filing Activity
Danfoss Silicon Power GmbH patent applications in 2024
Top 10 Technology Areas
- H02M7/003 (Conversion of ac power input into dc power output; Conversion of dc power input into ac power output)
- Count: 2 patents
- Example: 20240235411. CONDUCTOR STRUCTURE simplified abstract (Danfoss Silicon Power GmbH)
- H02M7/537 (using devices of a triode or transistor type requiring continuous application of a control signal {()
- Count: 2 patents
- Example: 20240235411. CONDUCTOR STRUCTURE simplified abstract (Danfoss Silicon Power GmbH)
- H01L24/49 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L24/45 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L25/072 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/45014 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/48137 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/4917 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/49175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Emerging Technology Areas
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- H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240243040. LEADFRAME simplified abstract (Danfoss Silicon Power GmbH)
- H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240243040. LEADFRAME simplified abstract (Danfoss Silicon Power GmbH)
- H01L21/4842 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
- Count: 1 patents
- Example: 20240243040. LEADFRAME simplified abstract (Danfoss Silicon Power GmbH)
- H01L21/4825 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
- Count: 1 patents
- Example: 20240243040. LEADFRAME simplified abstract (Danfoss Silicon Power GmbH)
- H01L23/49541 (Lead-frames {or other flat leads ()
- Count: 1 patents
- Example: 20240243040. LEADFRAME simplified abstract (Danfoss Silicon Power GmbH)
- H05K7/20281 (Modifications to facilitate cooling, ventilating, or heating)
- Count: 1 patents
- Example: 20240213117. ELECTRONIC COMPONENT COOLER simplified abstract (Danfoss Silicon Power GmbH)
- H01L23/473 (by flowing liquids {()
- Count: 1 patents
- Example: 20240213117. ELECTRONIC COMPONENT COOLER simplified abstract (Danfoss Silicon Power GmbH)
- H01L2924/10272 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/49175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/4917 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Top Inventors
- Fabio CARASTRO (2 patents)
- Henning STRÖBEL-MAIER (2 patents)
- Tobias SCHUETZ (1 patent)
- Robert ROESNER (1 patent)
- Guido MANNMEUSEL (1 patent)
- Xiaoting DONG (1 patent)
- Lukas TATZIG (1 patent)
- Karsten LUND (1 patent)
- Tobias APPEL (1 patent)
Patent Categories
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Geographical Distribution of Inventors
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Geographical Distribution of US Inventors
Danfoss Silicon Power GmbH Inventor States 2024 - Up to June 2024
Categories:
- Pages with broken file links
- Danfoss Silicon Power GmbH
- Companies
- CPC H02M7/003
- CPC H02M7/537
- CPC H01L24/49
- CPC H01L24/45
- CPC H01L24/48
- CPC H01L25/072
- CPC H01L2224/45014
- CPC H01L2224/48137
- CPC H01L2224/4917
- CPC H01L2224/49175
- CPC H01L2924/10272
- CPC H01L23/473
- CPC H05K7/20281
- CPC H01L23/49541
- CPC H01L21/4825
- CPC H01L21/4842
- CPC H01L21/56
- CPC H01L23/3107
- Patent Trends by Company in 2024
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