Category:Belgacem Haba of Saratoga CA (US)

Belgacem Haba of Saratoga CA (US)

Executive Summary

Belgacem Haba of Saratoga CA (US) is an inventor who has filed 18 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (10 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (9 patents), {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected} (8 patents), and they have worked with companies such as ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (14 patents), Adeia Semiconductor Bonding Technologies Inc. (4 patents). Their most frequent collaborators include (8 collaborations), (5 collaborations), (4 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 10 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 9 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 8 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L21/76898 ({formed through a semiconductor substrate}): 4 patents
• H01L23/5383 ({Multilayer substrates (): 3 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/06 ({of a plurality of bonding areas}): 3 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 3 patents
• H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/96 ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 2 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/573 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2225/06517 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2225/06524 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/1434 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/473 (by flowing liquids {(): 2 patents
• H01L23/528 ({Geometry or} layout of the interconnection structure {(): 2 patents
• H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 2 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 2 patents
• H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5223 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/17 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/16 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L28/60 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1205 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B27/0172 (Head-up displays): 1 patents
• G02B27/102 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B27/141 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L25/0753 (the devices being of a type provided for in group): 1 patents
• G02B2027/0178 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
• H01L2224/0801 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08057 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16221 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32221 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G01R31/275 (MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits): 1 patents
• G01R31/2856 (Testing of electronic circuits, e.g. by signal tracer ({EMC, EMP or similar testing of electronic circuits): 1 patents
• H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/3511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/35121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/26 ({Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto}): 1 patents
• H01L24/93 ({Batch processes}): 1 patents
• H01L24/74 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/802 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80908 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G01R31/2884 (Testing of electronic circuits, e.g. by signal tracer ({EMC, EMP or similar testing of electronic circuits): 1 patents
• H01L2224/08148 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 1 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/95 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L22/34 ({Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line (switching, multiplexing, gating devices): 1 patents
• H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/27 ({Manufacturing methods}): 1 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/49 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29082 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29187 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48106 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/49171 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73215 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05184 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76843 ({formed in openings in a dielectric}): 1 patents
• H01L21/76895 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L23/4824 (consisting of lead-in layers inseparably applied to the semiconductor body {(electrodes): 1 patents
• H01L2225/06544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/8221 ({Three dimensional integrated circuits stacked in different levels}): 1 patents
• H01L23/3171 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/074 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/14618 ({Containers}): 1 patents
• H01L27/14621 ({Colour filter arrangements}): 1 patents
• H01L27/14627 ({Microlenses}): 1 patents
• H01L27/14632 ({Wafer-level processed structures}): 1 patents
• H01L27/14634 ({Assemblies, i.e. Hybrid structures}): 1 patents
• H01L27/14636 ({Interconnect structures}): 1 patents
• H01L27/14687 ({Wafer level processing}): 1 patents
• H01L27/1469 ({Assemblies, i.e. hybrid integration}): 1 patents
• H01L2224/02379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06541 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06582 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06589 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/16151 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/16196 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/16251 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/427 (Cooling by change of state, e.g. use of heat pipes {(by liquefied gas): 1 patents
• H01L23/467 (by flowing gases, e.g. air {(): 1 patents
• H01L2224/08245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80009 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80357 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80486 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/04642 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/05042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/0544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/059 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents

Companies

List of Companies

• ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.: 14 patents
• Adeia Semiconductor Bonding Technologies Inc.: 4 patents

Collaborators

• Rajesh Katkar of Milpitas CA (US) (8 collaborations)
• Cyprian Emeka Uzoh of San Jose CA (US) (5 collaborations)
• Gaius Gillman Fountain, JR. of Youngsville NC (US) (4 collaborations)
• Javier A. DeLaCruz of San Jose CA (US) (3 collaborations)
• Guilian Gao of San Jose CA (US) (3 collaborations)
• Laura Wills Mirkarimi of Sunol CA (US) (3 collaborations)
• Thomas Workman of San Jose CA (US) (2 collaborations)
• Bongsub Lee of Santa Clara CA (US) (2 collaborations)
• Jung Ko of San Jose CA (US) (1 collaborations)
• Gabriel Z. Guevara of San Jose CA (US) (1 collaborations)
• Joy Watanabe of Campbell CA (US) (1 collaborations)
• Pawel Mrozek of San Jose CA (US) (1 collaborations)
• Guilian Gao of Campbell CA (US) (1 collaborations)
• Jeremy Alfred Theil of Mountain View CA (US) (1 collaborations)
• Paul M. Enquist of Cary NC (US) (1 collaborations)