18034831. THICKNESS MEASUREMENT DEVICE simplified abstract (LG ELECTRONICS INC.)

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THICKNESS MEASUREMENT DEVICE

Organization Name

LG ELECTRONICS INC.

Inventor(s)

Seohyeon Jo of Seoul (KR)

Daecheol Lim of Seoul (KR)

THICKNESS MEASUREMENT DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18034831 titled 'THICKNESS MEASUREMENT DEVICE

Simplified Explanation

The patent application describes a thickness measurement device that consists of a stage module, an upper optical module, and a lower optical module. The stage module is larger in size than the upper and lower optical modules and can move along the Y-axis. The device also includes a measurement specimen placement part, a specimen mounting part, and a specimen mounting part movement mechanism.

  • The device includes a stage module, upper optical module, and lower optical module.
  • The stage module can move along the Y-axis.
  • A measurement specimen can be placed on the measurement specimen placement part.
  • A reference or correction specimen can be selectively mounted on the specimen mounting part.
  • The specimen mounting part can move along the Z-axis.

Potential Applications

  • Thickness measurement in various industries such as semiconductor manufacturing, materials science, and quality control.
  • Non-destructive testing of thin films, coatings, and layers.
  • Research and development of new materials and processes.

Problems Solved

  • Accurate and precise measurement of thickness in various materials.
  • Ability to mount reference or correction specimens for calibration purposes.
  • Easy movement and positioning of the measurement specimen and mounting parts.

Benefits

  • Improved accuracy and precision in thickness measurement.
  • Flexibility to mount different types of specimens for calibration.
  • Easy and efficient movement and positioning of the measurement specimen and mounting parts.


Original Abstract Submitted

A thickness measurement device can include a stage module, an upper optical module above the stage module and spaced from the stage module in a Z-axis direction, a lower optical module below the stage module and spaced from the stage module in the Z-axis direction. The stage module has a larger area than the upper optical module and the lower optical module, a Y-axis movement mechanism for moving the stage along a Y-axis direction, a measurement specimen placement part which is disposed on the stage and on which a measurement specimen is placed, a specimen mounting part on which one of a reference specimen or a correction specimen is selectively mounted, and a specimen mounting part movement mechanism that is disposed on the stage and moves the specimen mounting part along the Z-axis direction.