18152122. MEMORY DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

From WikiPatents
Revision as of 17:38, 1 January 2024 by Wikipatents (talk | contribs) (Creating a new page)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search

MEMORY DEVICE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Elia Ambrosi of Hsinchu City (TW)

Xinyu Bao of Fremont CA (US)

Cheng-Hsien Wu of Hsinchu City (TW)

MEMORY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18152122 titled 'MEMORY DEVICE

Simplified Explanation

Abstract

A memory device is described in this patent application. The device consists of memory cells, each containing a resistance variable storage device and a selector. The selector is stacked on top of the storage device and connected to it through a shared terminal. The selector includes a switching layer made of a chalcogenide compound, with a thickness of 5 nm or less.

Bullet Points

  • Memory device with memory cells
  • Each cell has a resistance variable storage device and a selector
  • Selector is stacked on top of the storage device and connected through a shared terminal
  • Selector includes a switching layer made of a chalcogenide compound
  • Thickness of the switching layer is 5 nm or less

Potential Applications

  • Computer memory systems
  • Data storage devices
  • Solid-state drives (SSDs)
  • Internet of Things (IoT) devices
  • Wearable technology

Problems Solved

  • Improved memory cell design
  • Enhanced performance and reliability of memory devices
  • Increased data storage capacity
  • Reduced power consumption

Benefits

  • Higher data storage density
  • Faster read and write speeds
  • Lower power consumption
  • Improved durability and reliability of memory devices


Original Abstract Submitted

A memory device is provided. The memory device includes memory cells. Each of the memory cells includes: a resistance variable storage device; and a selector. The selector is stacked with the resistance variable storage device and coupled to the resistance variable storage device with a shared terminal, and includes a switching layer formed of a chalcogenide compound. A thickness of the switching layer is equal to or less than about 5 nm.