Category:Lifang Xu of Boise ID (US)
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Contents
Lifang Xu of Boise ID (US)
Executive Summary
Lifang Xu of Boise ID (US) is an inventor who has filed 4 patents. Their primary areas of innovation include ELECTRONIC MEMORY DEVICES (3 patents), ELECTRONIC MEMORY DEVICES (3 patents), ELECTRONIC MEMORY DEVICES (2 patents), and they have worked with companies such as Lodestar Licensing Group LLC (4 patents). Their most frequent collaborators include (3 collaborations), (1 collaborations), (1 collaborations).
Patent Filing Activity
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Technology Areas
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List of Technology Areas
- H10B43/27 (ELECTRONIC MEMORY DEVICES): 3 patents
- H10B43/35 (ELECTRONIC MEMORY DEVICES): 3 patents
- H10B43/40 (ELECTRONIC MEMORY DEVICES): 2 patents
- H01L21/76805 ({the opening being a via or contact hole penetrating the underlying conductor}): 2 patents
- H01L21/76816 ({Aspects relating to the layout of the pattern or to the size of vias or trenches (layout of the interconnections per se): 2 patents
- H01L21/76877 ({Thin films associated with contacts of capacitors}): 2 patents
- H01L21/76895 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 2 patents
- H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 2 patents
- H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 2 patents
- H10B41/10 (ELECTRONIC MEMORY DEVICES): 2 patents
- H10B41/27 (ELECTRONIC MEMORY DEVICES): 2 patents
- H10B41/35 (ELECTRONIC MEMORY DEVICES): 2 patents
- H01L21/76826 ({by contacting the layer with gases, liquids or plasmas}): 1 patents
- H10B41/41 (ELECTRONIC MEMORY DEVICES): 1 patents
- G11C16/08 (Address circuits; Decoders; Word-line control circuits): 1 patents
- H01L23/5329 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L29/40117 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H10B43/10 (ELECTRONIC MEMORY DEVICES): 1 patents
- H01L23/53257 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
Companies
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List of Companies
- Lodestar Licensing Group LLC: 4 patents
Collaborators
- John D. Hopkins of Meridian ID (US) (3 collaborations)
- Roger W. Lindsay of Boise ID (US) (1 collaborations)
- Shuangqiang Luo of Boise ID (US) (1 collaborations)
- Haitao Liu of Boise ID (US) (1 collaborations)
- Kamal M. Karda of Boise ID (US) (1 collaborations)
- Gurtej S. Sandhu of Boise ID (US) (1 collaborations)
- Sanh D. Tang of Boise ID (US) (1 collaborations)
- Akira Goda of Boise ID (US) (1 collaborations)
- Jordan D. Greenlee of Boise ID (US) (1 collaborations)
- Rita J. Klein of Boise ID (US) (1 collaborations)
- Everett A. McTeer of Eagle ID (US) (1 collaborations)
- Daniel Billingsley of Meridian ID (US) (1 collaborations)
- Collin Howder of Boise ID (US) (1 collaborations)
Subcategories
This category has the following 4 subcategories, out of 4 total.
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J
L
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Pages in category "Lifang Xu of Boise ID (US)"
The following 25 pages are in this category, out of 25 total.
1
- 17819538. ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES ISOLATED BY SLOT STRUCTURES, AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 17822421. MICROELECTRONIC DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 17822712. STAIRCASE FORMATION IN A MEMORY ARRAY simplified abstract (Micron Technology, Inc.)
- 17823472. METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 17876271. MEMORY DEVICE INCLUDING PREFORMED RECESSES BETWEEN CONTACT STRUCTURES AND CONTROL GATES simplified abstract (Micron Technology, Inc.)
- 17893718. FOLDED STAIRCASE VIA ROUTING FOR MEMORY simplified abstract (Micron Technology, Inc.)
- 17896919. STAIRCASE FORMATION IN A MEMORY ARRAY simplified abstract (Micron Technology, Inc.)
- 17930656. MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED METHODS, MEMORY DEVICES, AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18364397. MICROELECTRONIC DEVICES WITH MIRRORED BLOCKS OF MULTI-SET STAIRCASED STADIUMS, AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18420074. CHOPLESS FLOW FOR STAIRLESS ELECTRICAL INTERCONNECT STRUCTURE simplified abstract (Micron Technology, Inc.)
- 18428836. METHODS OF FORMING MICROELECTRONIC DEVICES simplified abstract (Micron Technology, Inc.)
- 18443013. MERGED CAVITIES FOR CONDUCTOR FORMATION IN A MEMORY DIE simplified abstract (Micron Technology, Inc.)
- 18513430. MICROELECTRONIC DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18623507. METHODS OF FORMING MICROELECTRONIC DEVICES simplified abstract (Micron Technology, Inc.)
- 18664203. LIGHT EMITTING DIODES AND ASSOCIATED METHODS OF MANUFACTURING simplified abstract (Micron Technology, Inc.)
- 18752525. METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING DIFFERENTLY SIZED CONDUCTIVE CONTACT STRUCTURES simplified abstract (Micron Technology, Inc.)
M
- Micron technology, inc. (20240186239). MICROELECTRONIC DEVICES WITH MULTIPLE STEP CONTACTS EXTENDING TO STEPPED TIERS, AND RELATED METHODS simplified abstract
- Micron technology, inc. (20240196606). MICROELECTRONIC DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS simplified abstract
- Micron technology, inc. (20240250024). CHOPLESS FLOW FOR STAIRLESS ELECTRICAL INTERCONNECT STRUCTURE simplified abstract
- Micron technology, inc. (20240250033). METHODS OF FORMING MICROELECTRONIC DEVICES simplified abstract
- Micron technology, inc. (20240284672). MERGED CAVITIES FOR CONDUCTOR FORMATION IN A MEMORY DIE simplified abstract
- Micron technology, inc. (20240297269). LIGHT EMITTING DIODES AND ASSOCIATED METHODS OF MANUFACTURING simplified abstract
- Micron technology, inc. (20240347464). METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING DIFFERENTLY SIZED CONDUCTIVE CONTACT STRUCTURES simplified abstract
Categories:
- John D. Hopkins of Meridian ID (US)
- Roger W. Lindsay of Boise ID (US)
- Shuangqiang Luo of Boise ID (US)
- Haitao Liu of Boise ID (US)
- Kamal M. Karda of Boise ID (US)
- Gurtej S. Sandhu of Boise ID (US)
- Sanh D. Tang of Boise ID (US)
- Akira Goda of Boise ID (US)
- Jordan D. Greenlee of Boise ID (US)
- Rita J. Klein of Boise ID (US)
- Everett A. McTeer of Eagle ID (US)
- Daniel Billingsley of Meridian ID (US)
- Collin Howder of Boise ID (US)
- Lifang Xu of Boise ID (US)
- Inventors
- Inventors filing patents with Lodestar Licensing Group LLC
