Category:Kazuma SEKIYA

Kazuma SEKIYA

Executive Summary

Kazuma SEKIYA is an inventor who has filed 3 patents. Their primary areas of innovation include Mechanical treatment, e.g. grinding, polishing, cutting {( (3 patents), SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal (2 patents), to produce devices, e.g. integrated circuits, each consisting of a plurality of components (1 patents), and they have worked with companies such as DISCO CORPORATION (3 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 3 patents
• B23K26/53 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 2 patents
• H01L21/8213 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/822 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• B23K2101/40 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses): 1 patents

Companies

List of Companies

• DISCO CORPORATION: 3 patents

Collaborators

• Kazuya HIRATA (1 collaborations)
• Hayato IGA (1 collaborations)