Category:Chen-Hua Yu

Chen-Hua Yu

Executive Summary

Chen-Hua Yu is an inventor who has filed 14 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (8 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (7 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (14 patents). Their most frequent collaborators include (5 collaborations), (4 collaborations), (3 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L23/5383 ({Multilayer substrates (): 5 patents
• H01L2224/214 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 4 patents
• H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 4 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 4 patents
• H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 4 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 4 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/3114 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 3 patents
• H01L2224/12105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/18 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2221/68372 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/24137 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/66 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/92244 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/04105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/73267 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2225/06524 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/367 (Cooling facilitated by shape of device {(): 2 patents
• H01L24/96 ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 2 patents
• G02B6/12004 (of the integrated circuit kind (electric integrated circuits): 2 patents
• H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/24 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 2 patents
• H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/215 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• G02B6/4239 (Coupling light guides with opto-electronic elements): 2 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 2 patents
• H01L24/02 ({Bonding areas (on insulating substrates, e.g. chip carriers,): 2 patents
• H01L2224/024 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L2221/68359 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
• H01L25/0753 (the devices being of a type provided for in group): 1 patents
• H01L33/105 ({with a resonant cavity structure}): 1 patents
• H01L33/465 ({with a resonant cavity structure}): 1 patents
• H01L33/52 (Encapsulations): 1 patents
• H01L2933/0025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2933/0033 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2933/005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01S5/022 (Mountings; Housings): 1 patents
• H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 1 patents
• H01Q1/2283 ({mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}): 1 patents
• H01Q21/0087 ({Apparatus or processes specially adapted for manufacturing antenna arrays (manufacturing waveguides): 1 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2223/6688 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73253 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/81005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2223/6616 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2223/6677 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2223/6683 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06548 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06558 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06572 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06586 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06555 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5381 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L2224/95001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/13 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
• H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05018 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05027 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05571 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05624 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05644 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/09181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13111 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13139 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/244 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80357 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/1023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01013 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01028 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01029 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01047 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01074 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01079 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/014 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/4243 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4214 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4251 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4274 (Coupling light guides with opto-electronic elements): 1 patents
• H01L25/167 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• G02B6/4202 (Coupling light guides with opto-electronic elements): 1 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L2225/06544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/10157 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0801 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05016 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05556 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05576 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13026 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/12 ({Structure, shape, material or disposition of the bump connectors prior to the connecting process}): 1 patents
• H01L25/065 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/02331 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/02379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48464 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/00014 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/10252 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/10253 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/10272 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/10329 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1203 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1304 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49503 (Lead-frames {or other flat leads (): 1 patents
• H01L24/06 ({of a plurality of bonding areas}): 1 patents
• H01L24/18 ({High density interconnect [HDI] connectors; Manufacturing methods related thereto (interconnection structure between a plurality of semiconductor chips): 1 patents
• H01L24/25 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/02375 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/02381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05558 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05569 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05572 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05666 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05684 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0603 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/06051 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/06102 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/06181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/09051 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/09055 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/14181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/82 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/82986 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/1035 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/18162 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/37001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/34 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B6/4201 (Coupling light guides with opto-electronic elements): 1 patents
• G02B2006/12104 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B2006/12114 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L23/46 (involving the transfer of heat by flowing fluids (): 1 patents
• H01L23/3157 ({Partial encapsulation or coating (mask layer used as insulation layer): 1 patents
• H01L23/433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29018 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
• H01L2221/68381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2223/6627 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/24225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1434 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/2101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• Taiwan Semiconductor Manufacturing Company, Ltd.: 14 patents

Collaborators

• Kuo-Chung Yee (5 collaborations)
• Chun-Hui Yu (4 collaborations)
• Chung-Hao Tsai (3 collaborations)
• Chuei-Tang WANG (3 collaborations)
• Chien-Hsun Chen (2 collaborations)
• Chung-Ming Weng (2 collaborations)
• Chung-Shi Liu (2 collaborations)
• Cheng-Chieh Hsieh (2 collaborations)
• Hung-Yi Kuo (2 collaborations)
• Tsung-Yuan Yu (2 collaborations)
• Che-Hsiang Hsu (2 collaborations)
• Jeng-Nan Hung (2 collaborations)
• Po-Fan Lin (2 collaborations)
• Keng-Han Lin (1 collaborations)
• Hung-Jui Kuo (1 collaborations)
• Hui-Jung Tsai (1 collaborations)
• Wei-Ting Chen (1 collaborations)
• Shih-Ya Huang (1 collaborations)
• Chih-Wei Tseng (1 collaborations)
• Hsing-Kuo Hsia (1 collaborations)
• Stefan Rusu of Sunnydale CA (US) (1 collaborations)
• Chewn-Pu Jou (1 collaborations)
• Tso-Jung Chang (1 collaborations)
• Jeng-Shien Hsieh (1 collaborations)
• Shih-Ping Lin (1 collaborations)
• Chih-Peng Lin (1 collaborations)
• Chieh-Yen Chen (1 collaborations)
• Hao-Yi Tsai (1 collaborations)
• Hua-Kuei Lin (1 collaborations)
• Chih-Chieh Chang (1 collaborations)
• Chuei-Tang Wang (1 collaborations)
• Chih-Hsin Lu (1 collaborations)
• Shou-Yi Wang (1 collaborations)
• Jiun Yi Wu (1 collaborations)