US Patent Application 18447409. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
Contents
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hsuan-Ting Kuo of Taichung (TW)
Chih-Chiang Tsao of Taoyuan (TW)
Philip Yu-Shuan Chung of Taipei (TW)
Ching-Hua Hsieh of Hsinchu (TW)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18447409 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Simplified Explanation
The patent application describes a method for forming solder connections in electronic devices.
- The method involves applying solder paste to certain areas of a redistribution structure, which has a lower melting temperature.
- Solder bumps, with a higher melting temperature, are then formed on an interconnect structure.
- The solder bumps are placed on the regions of solder paste.
- A first reflow process is performed at a lower temperature, causing the solder paste to melt and form connections.
- After the first reflow process, a second reflow process is performed at a higher temperature to further strengthen the connections.
Original Abstract Submitted
A method includes forming regions of solder paste on a redistribution structure, wherein the solder paste has a first melting temperature; forming solder bumps on an interconnect structure, wherein the solder bumps have a second melting temperature that is greater than the first melting temperature; placing the solder bumps on the regions of solder paste; performing a first reflow process at a first reflow temperature for a first duration of time, wherein the first reflow temperature is less than the second melting temperature; and after performing the first reflow process, performing a second reflow process at a second reflow temperature for a second duration of time, wherein the second reflow temperature is greater than the second melting temperature.
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen of Taipei (TW)
- Hao-Jan Pei of Hsinchu (TW)
- Hsuan-Ting Kuo of Taichung (TW)
- Chih-Chiang Tsao of Taoyuan (TW)
- Jen-Jui Yu of Taipei (TW)
- Philip Yu-Shuan Chung of Taipei (TW)
- Chia-Lun Chang of Tainan (TW)
- Hsiu-Jen Lin of Zhubei (TW)
- Ching-Hua Hsieh of Hsinchu (TW)
- H01L21/50
- H01L21/48
- H01L23/00
- B23K1/00
- H01L21/60