Category:Yosuke HIMORI

Yosuke HIMORI

Executive Summary

Yosuke HIMORI is an inventor who has filed 3 patents. Their primary areas of innovation include Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se (1 patents), CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes (1 patents), Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor (1 patents), and they have worked with companies such as EBARA CORPORATION (3 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• B08B1/14 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• B08B1/20 (Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor): 1 patents
• B08B1/34 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• B08B3/041 ({Cleaning travelling work}): 1 patents
• H01L21/67034 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67046 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/68707 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H05F1/00 (Preventing the formation of electrostatic charges): 1 patents
• B08B1/40 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• B08B1/36 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• B24B5/162 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth): 1 patents
• B24B7/04 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth): 1 patents
• B24B27/003 (Other grinding machines or devices): 1 patents
• B24B27/04 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth): 1 patents
• B24B5/26 (MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth): 1 patents

Companies

List of Companies

• EBARA CORPORATION: 3 patents

Collaborators

• Koichi FUKAYA (1 collaborations)
• Toshio MIZUNO (1 collaborations)