Category:Rajesh Katkar of Milpitas CA (US)

Rajesh Katkar of Milpitas CA (US)

Executive Summary

Rajesh Katkar of Milpitas CA (US) is an inventor who has filed 13 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected} (5 patents), and they have worked with companies such as ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (12 patents), Adeia Semiconductor Bonding Technologies Inc. (1 patents). Their most frequent collaborators include (8 collaborations), (8 collaborations), (5 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 5 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L21/76898 ({formed through a semiconductor substrate}): 3 patents
• H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 2 patents
• H01L2224/05147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/05181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/08146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/573 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/06 ({of a plurality of bonding areas}): 2 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 2 patents
• H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• G02B27/0172 (Head-up displays): 1 patents
• G02B27/102 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B27/141 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L25/0753 (the devices being of a type provided for in group): 1 patents
• G02B2027/0178 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L23/053 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3157 ({Partial encapsulation or coating (mask layer used as insulation layer): 1 patents
• H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/473 (by flowing liquids {(): 1 patents
• H01L2224/03462 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/03464 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0347 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/03616 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0362 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0384 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/03845 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05013 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05015 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05026 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05076 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05082 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05109 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05111 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05144 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05166 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05171 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05551 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05554 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05555 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05576 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05578 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05605 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05609 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05611 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05639 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05644 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80375 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/3511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/35121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/04042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80948 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/26 ({Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto}): 1 patents
• H01L24/93 ({Batch processes}): 1 patents
• H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 1 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/95 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L22/34 ({Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line (switching, multiplexing, gating devices): 1 patents
• H01L23/528 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L24/27 ({Manufacturing methods}): 1 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/49 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29082 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29187 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48106 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/49171 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73215 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05184 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08057 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76843 ({formed in openings in a dielectric}): 1 patents
• H01L21/76895 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L23/4824 (consisting of lead-in layers inseparably applied to the semiconductor body {(electrodes): 1 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06524 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.: 12 patents
• Adeia Semiconductor Bonding Technologies Inc.: 1 patents

Collaborators

• Belgacem Haba of Saratoga CA (US) (8 collaborations)
• Cyprian Emeka Uzoh of San Jose CA (US) (8 collaborations)
• Laura Wills Mirkarimi of Sunol CA (US) (5 collaborations)
• Guilian Gao of San Jose CA (US) (4 collaborations)
• Gaius Gillman Fountain, JR. of Youngsville NC (US) (3 collaborations)
• Thomas Workman of San Jose CA (US) (2 collaborations)
• Javier A. DeLaCruz of San Jose CA (US) (2 collaborations)
• Jeremy Alfred Theil of Mountain View CA (US) (2 collaborations)
• Bongsub Lee of Santa Clara CA (US) (2 collaborations)
• Gabriel Z. Guevara of San Jose CA (US) (1 collaborations)
• Joy Watanabe of Campbell CA (US) (1 collaborations)
• Dominik Suwito of San Jose CA (US) (1 collaborations)
• Guilian Gao of Campbell CA (US) (1 collaborations)