Category:Cyprian Emeka Uzoh of San Jose CA (US)

From WikiPatents
Revision as of 08:11, 18 July 2024 by Wikipatents (talk | contribs) (Updating Category:Cyprian_Emeka_Uzoh_of_San_Jose_CA_(US))
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search

Cyprian Emeka Uzoh of San Jose CA (US)

Executive Summary

Cyprian Emeka Uzoh of San Jose CA (US) is an inventor who has filed 18 patents. Their primary areas of innovation include {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected} (10 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (9 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (9 patents), and they have worked with companies such as ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (16 patents), Adeia Semiconductor Bonding Technologies Inc. (2 patents). Their most frequent collaborators include (8 collaborations), (5 collaborations), (4 collaborations).

Patent Filing Activity

Cyprian Emeka Uzoh of San Jose CA (US) Monthly Patent Applications.png

Technology Areas

Cyprian Emeka Uzoh of San Jose CA (US) Top Technology Areas.png

List of Technology Areas

  • H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 10 patents
  • H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 9 patents
  • H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 9 patents
  • H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
  • H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
  • H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
  • H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
  • H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 5 patents
  • H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
  • H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L2224/80031 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L2224/05147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L21/76898 ({formed through a semiconductor substrate}): 3 patents
  • H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/03462 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/03616 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/05082 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/05166 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/05181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/08146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2924/3511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/80013 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/80011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 2 patents
  • H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/05184 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/80047 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/80365 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/04642 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/0504 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/0544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/059 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/053 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/3157 ({Partial encapsulation or coating (mask layer used as insulation layer): 1 patents
  • H01L23/473 (by flowing liquids {(): 1 patents
  • H01L2224/03464 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/0347 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/0362 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/0384 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/03845 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05013 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05015 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05026 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05076 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05109 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05111 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05144 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05171 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05551 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05554 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05555 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05576 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05578 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05605 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05609 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05611 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05639 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05644 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/80375 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/0401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/35121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 1 patents
  • H01L21/306 (Chemical or electrical treatment, e.g. electrolytic etching (to form insulating layers): 1 patents
  • H01L21/3081 (using masks (): 1 patents
  • H01L21/683 (for supporting or gripping (for conveying): 1 patents
  • H01L23/3135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/06513 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/06541 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/1304 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/1434 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/1461 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/351 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/3512 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L21/67046 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
  • H01L21/67051 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
  • H01L21/67132 ({Apparatus for placing on an insulating substrate, e.g. tape}): 1 patents
  • H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
  • H01L23/48 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
  • H01L25/065 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L21/6836 ({Wafer tapes, e.g. grinding or dicing support tapes (adhesive tapes in general): 1 patents
  • H01L21/6838 (for supporting or gripping (for conveying): 1 patents
  • H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
  • H01L21/67144 ({Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}): 1 patents
  • H01L2224/81005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/81801 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/80006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2221/68322 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2221/68336 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2221/68363 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2221/68381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/80012 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/80019 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 1 patents
  • H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
  • H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
  • H01L24/95 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
  • H01L2221/68309 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2221/68313 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2221/68354 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/5381 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
  • H01L22/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/06572 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/06582 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/06596 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L24/06 ({of a plurality of bonding areas}): 1 patents
  • H01L2224/08057 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/08147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L21/76843 ({formed in openings in a dielectric}): 1 patents
  • H01L21/76895 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
  • H01L23/4824 (consisting of lead-in layers inseparably applied to the semiconductor body {(electrodes): 1 patents
  • H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/06524 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2225/06544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • B32B15/016 (all layers being exclusively metallic {(making layered metal workpieces by pressure cladding): 1 patents
  • B32B3/266 ({characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells): 1 patents
  • B32B3/30 (characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer): 1 patents
  • B32B15/017 (all layers being exclusively metallic {(making layered metal workpieces by pressure cladding): 1 patents
  • B32B15/20 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
  • B32B2250/02 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
  • B32B2307/202 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
  • B32B2307/206 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
  • B32B2311/22 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
  • B32B2311/24 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
  • H01L2224/0345 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/03614 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05073 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05186 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05571 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05624 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/8002 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/80357 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/80906 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/04941 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/298 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L23/3178 ({Coating or filling in grooves made in the semiconductor body}): 1 patents

Companies

Cyprian Emeka Uzoh of San Jose CA (US) Top Companies.png

List of Companies

  • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.: 16 patents
  • Adeia Semiconductor Bonding Technologies Inc.: 2 patents

Collaborators