Category:H01L25/18
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H01L 25/18 - Overview
H01L 25/18 is a subsection of the International Patent Classification system, specifically within the category of H01L, which pertains to semiconductor devices; electric solid state devices not otherwise provided for. This particular code focuses on:
- Semiconductor Devices
- Aspects related to semiconductor devices which are structurally and functionally integrated.
- Electric Solid State Devices
- This involves devices that leverage the electrical properties of solid materials to control the flow of current.
- Multi-chip Modules (MCM)
- H01L 25/18 specifically addresses multi-chip modules (MCM). These are electronic components where multiple integrated circuits (ICs), semiconductor dies, or other discrete components are packaged onto a unifying substrate, enhancing performance and reducing size.
Key Innovations and Companies in H01L 25/18
Several companies have made significant contributions in the field covered by H01L 25/18:
- Intel Corporation
- Intel has been a leader in developing advanced multi-chip modules, integrating various functions like CPU, GPU, and memory in compact forms. Their innovations often involve high-speed interconnects and efficient heat dissipation technologies.
- Samsung Electronics
- Samsung's advancements in multi-chip module technology are notable, particularly in the integration of memory and logic components, which is crucial for mobile devices and high-performance computing systems.
- Lesser-Known Innovators
- Smaller companies like XYZ Semiconductors (fictional example) also contribute significantly to this field, often focusing on specialized applications or novel integration techniques.
IPC Classifications and Categories
The innovations in H01L 25/18 fall into several categories under the IPC system. These include:
- H01L29 - Semiconductor devices based on specific semiconductors
- H01L31 - Solid state devices using organic materials
See Also
Pages in category "H01L25/18"
The following 200 pages are in this category, out of 620 total.
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- 18514763. COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY simplified abstract (Micron Technology, Inc.)
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- 18515274. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517330. BUFFER DESIGN FOR PACKAGE INTEGRATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517980. SUBSTRATES FOR SEMICONDUCTOR PACKAGES simplified abstract (Micron Technology, Inc.)
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- 18536332. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
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- 18539949. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
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- 18558060. ELECTRONIC DEVICE simplified abstract (SEMICONDUCTOR ENERGY LABORATORY CO., LTD.)
- 18558079. Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18558085. DISPLAY APPARATUS simplified abstract (SEMICONDUCTOR ENERGY LABORATORY CO., LTD.)
- 18559123. MICRO SYSTEM COMPRISING A PLURALITY OF FUNCTIONAL CELLS simplified abstract (ams-OSRAM International GmbH)
- 18584044. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18586366. SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18588547. SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)
- 18588699. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18593467. VERTICAL MEMORY DEVICES simplified abstract (YANGTZE MEMORY TECHNOLOGIES CO., LTD.)
- 18594742. SEMICONDUCTOR DEVICE AND METHODS FOR MANUFACTURING THE SAME simplified abstract (Kioxia Corporation)
- 18595303. STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18595321. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18595329. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18596514. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18598250. MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18598486. TRANSFORMER ARRANGEMENT simplified abstract (Infineon Technologies Austria AG)
- 18599802. MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18600146. MEMORY DEVICES AND RELATED METHODS OF FORMING A MEMORY DEVICE simplified abstract (Micron Technology, Inc.)
- 18602533. INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18603779. INTEGRATED CIRCUIT PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18604050. TRUTH TABLE EXTENSION FOR STACKED MEMORY SYSTEMS simplified abstract (MICRON TECHNOLOGY, INC.)
- 18604671. DISPLAY DEVICE WITH IMAGE SENSOR simplified abstract (Innolux Corporation)
- 18604848. SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18605956. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18610104. OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES simplified abstract (Intel Corporation)
- 18610282. SEMICONDUCTOR MEMORY simplified abstract (Kioxia Corporation)
- 18611413. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18612282. PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18612474. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18617113. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18619037. HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEMENTS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18619338. DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18621775. DISPLAY APPARATUS simplified abstract (BOE Technology Group Co., Ltd.)
- 18622153. POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE SEMICONDUCTOR DEVICE, AND METALLIC MOLD simplified abstract (ROHM CO., LTD.)
- 18624411. Integrated Circuit Package For High Bandwidth Memory simplified abstract (GOOGLE LLC)
- 18626579. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18628233. SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18640167. HYBRID BONDING WITH UNIFORM PATTERN DENSITY simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18648971. BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME simplified abstract (Yangtze Memory Technologies Co., LTD.)
- 18650157. METALLIZATION LAYER AND FABRICATION METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18659400. SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18660967. SEMICONDUCTOR DEVICE simplified abstract (ROHM Co., LTD.)
- 18664483. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18669679. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18671649. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18674610. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18675881. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18732377. MEMORY DEVICE WITH IMPROVED PROGRAM PERFORMANCE AND METHOD OF OPERATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18735409. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
A
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- Apple inc. (20240105699). 3D System and Wafer Reconstitution with Mid-layer Interposer simplified abstract
- Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
- Apple inc. (20240105704). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
- Apple inc. (20240243012). Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module simplified abstract
- Apple inc. (20240332319). Electronic Devices with Displays and Conductive Traces simplified abstract
- Apple Inc. patent applications on July 18th, 2024
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B
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- Boe technology group co., ltd. (20240297203). LIGHT EMITTING CHIP AND MANUFACTURING METHOD FOR THE SAME, AND LIGHT EMITTING DEVICE simplified abstract
- BOE Technology Group Co., Ltd. patent applications on August 15th, 2024
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C
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H
I
- Intel corporation (20240105700). SILICON CARBIDE POWER DEVICES INTEGRATED WITH SILICON LOGIC DEVICES simplified abstract
- Intel corporation (20240113033). DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE simplified abstract
- Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240128162). NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract
- Intel corporation (20240128253). LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL simplified abstract
- Intel corporation (20240128255). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240128256). MULTI-CHIP PACKAGING simplified abstract
- Intel corporation (20240136269). ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE simplified abstract
- Intel corporation (20240136323). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240186206). INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY simplified abstract
- Intel corporation (20240213170). GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS simplified abstract
- Intel corporation (20240213235). ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240215269). GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract
- Intel corporation (20240219629). PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES simplified abstract
- Intel corporation (20240222219). PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES simplified abstract
- Intel corporation (20240222279). TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE simplified abstract
- Intel corporation (20240222345). DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING simplified abstract
- Intel corporation (20240222346). ARCHITECTURES FOR MEMORY ON INTEGRATED CIRCUIT DEVICE PACKAGES simplified abstract
- Intel corporation (20240222347). MODULAR MEMORY BLOCKS FOR INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240222350). OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES simplified abstract
- Intel corporation (20240234283). ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE simplified abstract
- Intel corporation (20240258296). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240332322). INDUCTORLESS CIRCUITS FOR CURRENT-VOLTAGE CONTROL AND REGULATION IN GLASS CORE simplified abstract
- Intel corporation (20240334715). FOR MEMORY ON PACKAGE WITH REDUCED THICKNESS simplified abstract
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on April 25th, 2024
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on August 1st, 2024
- Intel Corporation patent applications on January 18th, 2024
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- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on June 6th, 2024
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- Intel Corporation patent applications on March 28th, 2024
- Intel Corporation patent applications on October 3rd, 2024
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- International business machines corporation (20240203822). THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract
- International business machines corporation (20240215270). HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION simplified abstract
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K
- Kabushiki kaisha toshiba (20240321850). ISOLATOR simplified abstract
- Kabushiki Kaisha Toshiba patent applications on September 26th, 2024
- Kioxia corporation (20240098999). SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240099013). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240099031). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240099032). SEMICONDUCTOR STORAGE DEVICE simplified abstract
- Kioxia corporation (20240099033). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240304576). SEMICONDUCTOR DEVICE simplified abstract
- Kioxia corporation (20240304602). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240306388). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240312976). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract
- Kioxia corporation (20240315016). SEMICONDUCTOR DEVICE AND METHODS FOR MANUFACTURING THE SAME simplified abstract
- Kioxia corporation (20240315058). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240321852). SEMICONDUCTOR STORAGE DEVICE simplified abstract
- Kioxia corporation (20240324207). SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Kioxia corporation (20240324217). MEMORY DEVICE simplified abstract
- Kioxia corporation (20240324220). SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE simplified abstract
- Kioxia corporation (20240324249). STORAGE DEVICE simplified abstract
- Kioxia corporation (20240324250). SEMICONDUCTOR MEMORY simplified abstract
- Kioxia Corporation patent applications on March 21st, 2024
- Kioxia Corporation patent applications on September 12th, 2024
- Kioxia Corporation patent applications on September 19th, 2024
- Kioxia Corporation patent applications on September 26th, 2024
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- Meta Platforms Technologies, LLC patent applications on October 3rd, 2024
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- Micron technology, inc. (20240194565). COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY simplified abstract
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- Micron technology, inc. (20240203827). THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SUBSTRATE simplified abstract
- Micron technology, inc. (20240220163). TRUTH TABLE EXTENSION FOR STACKED MEMORY SYSTEMS simplified abstract
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- Micron technology, inc. (20240256473). NEUROMORPHIC MEMORY DEVICE AND METHOD simplified abstract
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- Micron technology, inc. (20240282385). ON-DIE CAPACITOR BANKS simplified abstract
- Micron technology, inc. (20240306403). STACKED SEMICONDUCTOR DEVICE simplified abstract
- Micron Technology, Inc. patent applications on April 18th, 2024
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