Category:H01L25/18
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Contents
H01L 25/18 - Overview
H01L 25/18 is a subsection of the International Patent Classification system, specifically within the category of H01L, which pertains to semiconductor devices; electric solid state devices not otherwise provided for. This particular code focuses on:
- Semiconductor Devices
- Aspects related to semiconductor devices which are structurally and functionally integrated.
- Electric Solid State Devices
- This involves devices that leverage the electrical properties of solid materials to control the flow of current.
- Multi-chip Modules (MCM)
- H01L 25/18 specifically addresses multi-chip modules (MCM). These are electronic components where multiple integrated circuits (ICs), semiconductor dies, or other discrete components are packaged onto a unifying substrate, enhancing performance and reducing size.
Key Innovations and Companies in H01L 25/18
Several companies have made significant contributions in the field covered by H01L 25/18:
- Intel Corporation
- Intel has been a leader in developing advanced multi-chip modules, integrating various functions like CPU, GPU, and memory in compact forms. Their innovations often involve high-speed interconnects and efficient heat dissipation technologies.
- Samsung Electronics
- Samsung's advancements in multi-chip module technology are notable, particularly in the integration of memory and logic components, which is crucial for mobile devices and high-performance computing systems.
- Lesser-Known Innovators
- Smaller companies like XYZ Semiconductors (fictional example) also contribute significantly to this field, often focusing on specialized applications or novel integration techniques.
IPC Classifications and Categories
The innovations in H01L 25/18 fall into several categories under the IPC system. These include:
- H01L29 - Semiconductor devices based on specific semiconductors
- H01L31 - Solid state devices using organic materials
See Also
Pages in category "H01L25/18"
The following 200 pages are in this category, out of 422 total.
(previous page) (next page)1
- 18149206. MEMORY DEVICES HAVING CELL OVER PERIPHERY STRUCTURE, MEMORY PACKAGES INCLUDING THE SAME, AND METHODS OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18150034. Packaged Memory Device and Method simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18151545. INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151622. PACKAGED MULTI-CHIP SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18151629. INTEGRATED CIRCUIT PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18152453. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18152665. Integrated Circuit Package With Improved Heat Dissipation Efficiency and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.)
- 18165419. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18167369. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18169579. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18172975. WAFER LEVEL PACKAGING PROCESS FOR THIN FILM INDUCTORS simplified abstract (QUALCOMM Incorporated)
- 18199553. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18204970. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18207475. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18212323. INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM COMPRISING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18214341. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18215474. MEMORY DEVICE INTERFACE AND METHOD simplified abstract (Micron Technology, Inc.)
- 18218886. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18223854. DISPLAY APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18235033. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18236607. METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18236664. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18238099. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18241531. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18241592. FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH simplified abstract (MICRON TECHNOLOGY, INC.)
- 18260810. INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS simplified abstract (Intel Corporation)
- 18298702. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18301706. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18302023. PACKAGE INCLUDING COMPOSITE INTERPOSER AND/OR COMPOSITE PACKAGING SUBSTRATE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18302466. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18302466. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18309149. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18313491. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18322040. HIGHLY VERTICALLY INTEGRATED NONVOLATILE MEMORY DEVICES AND MEMORY SYSTEMS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18322774. SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18323440. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18323440. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18323528. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18337180. INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18339132. DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES simplified abstract (APPLE INC.)
- 18342182. SOLID STATE DRIVE APPARATUS AND DATA STORAGE APPARATUS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18343011. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18344564. TRANSFORMER DEVICE AND SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18344927. SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18347313. Liquid Immersion-Cooled Power Module simplified abstract (Hyundai Motor Company)
- 18347313. Liquid Immersion-Cooled Power Module simplified abstract (Kia Corporation)
- 18349017. NONVOLATILE MEMORY DEVICE, SYSTEM INCLUDING THE SAME AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18353279. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18353621. THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A MID-STACK SOURCE LAYER AND METHODS FOR FORMING THE SAME simplified abstract (SanDisk Technologies LLC)
- 18355718. SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18361189. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18364578. DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18367704. INTEGRATED CIRCUIT DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368760. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368760. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18374392. MEMORY DEVICE INCLUDING STACKED PASS TRANSISTORS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18376467. CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18381061. INTERPOSERS FOR MICROELECTRONIC DEVICES simplified abstract (Micron Technology, Inc.)
- 18381905. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18381905. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18383370. GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT DEEP VIA SUBSTRATE CONTACTS FOR SUB-FIN ELECTRICAL CONTACT simplified abstract (Intel Corporation)
- 18397105. ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- 18397873. MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation)
- 18397891. MULTI-CHIP PACKAGING simplified abstract (Intel Corporation)
- 18397906. NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract (Intel Corporation)
- 18399105. SEMICONDUCTOR POWER MODULE simplified abstract (ROHM CO., LTD.)
- 18399178. LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL simplified abstract (Intel Corporation)
- 18400497. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18400497. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18400994. TECHNIQUES FOR MODULAR DIE CONFIGURATIONS FOR MULTI-CHANNEL MEMORY simplified abstract (Micron Technology, Inc.)
- 18404516. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18417153. Display Device and System simplified abstract (SEMICONDUCTOR ENERGY LABORATORY CO., LTD.)
- 18418964. STACKED-CHIP PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18419399. SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18422550. THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18423229. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18432788. SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT simplified abstract (SK hynix Inc.)
- 18433436. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18435272. SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (SK hynix Inc.)
- 18452616. MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18453611. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)
- 18458069. SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18458743. MEMORY DEVICE TRANSMITTING AND RECEIVING DATA AT HIGH SPEED AND LOW POWER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18462600. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation)
- 18462709. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18465244. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18469493. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Mitsubishi Electric Corporation)
- 18475926. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18478821. MICROELECTRONIC DEVICES, AND METHODS OF FORMING MICROELECTRONIC DEVICES simplified abstract (Micron Technology, Inc.)
- 18480310. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18481975. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18482663. SEMICONDUCTOR DEVICE HAVING DIE RING CONDUCTOR simplified abstract (Micron Technology, Inc.)
- 18486416. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18486831. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18496383. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18499242. METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18503453. System, Device and Methods of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18508663. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18512199. PROCESSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18514436. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18514763. COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY simplified abstract (Micron Technology, Inc.)
- 18515264. SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515274. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517330. BUFFER DESIGN FOR PACKAGE INTEGRATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517980. SUBSTRATES FOR SEMICONDUCTOR PACKAGES simplified abstract (Micron Technology, Inc.)
- 18518187. Integrated Circuit Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518794. FABRICATING METHOD OF SEMICONDUCTOR DIE WITH TAPERED SIDEWALL IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18519872. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18520405. CHIP SELECT WIRING FOR A DUAL DEVICE PACKAGE simplified abstract (Micron Technology, Inc.)
- 18520958. Semiconductor Device and Method of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18522829. NONVOLATILE MEMORY DEVICE AND METHOD OF OPERATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18529365. MEMORY DEVICE AND SYSTEM HAVING MULTIPLE PHYSICAL INTERFACES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18530896. BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE simplified abstract (Micron Technology, Inc.)
- 18536332. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18536332. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18538458. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18539949. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18545996. STACKED MICROELECTRONIC PACKAGES INCLUDING INTERPOSER STRUCTURES AND RELATED METHODS, DEVICES, AND SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18556265. POWER MODULE simplified abstract (Mitsubishi Electric Corporation)
- 18558060. ELECTRONIC DEVICE simplified abstract (SEMICONDUCTOR ENERGY LABORATORY CO., LTD.)
- 18558079. Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18558085. DISPLAY APPARATUS simplified abstract (SEMICONDUCTOR ENERGY LABORATORY CO., LTD.)
- 18559123. MICRO SYSTEM COMPRISING A PLURALITY OF FUNCTIONAL CELLS simplified abstract (ams-OSRAM International GmbH)
- 18588699. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18600146. MEMORY DEVICES AND RELATED METHODS OF FORMING A MEMORY DEVICE simplified abstract (Micron Technology, Inc.)
- 18602533. INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18603779. INTEGRATED CIRCUIT PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18604050. TRUTH TABLE EXTENSION FOR STACKED MEMORY SYSTEMS simplified abstract (MICRON TECHNOLOGY, INC.)
- 18610104. OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES simplified abstract (Intel Corporation)
- 18612474. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18617113. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18619037. HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEMENTS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18619338. DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18621775. DISPLAY APPARATUS simplified abstract (BOE Technology Group Co., Ltd.)
A
- Apple inc. (20240105545). Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding simplified abstract
- Apple inc. (20240105699). 3D System and Wafer Reconstitution with Mid-layer Interposer simplified abstract
- Apple inc. (20240105702). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
- Apple inc. (20240105704). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract
- Apple inc. (20240243012). Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module simplified abstract
- Apple Inc. patent applications on July 18th, 2024
- Apple Inc. patent applications on March 28th, 2024
B
C
- Chengdu boe optoelectronics technology co., ltd. (20240244751). DISPLAY APPARATUS simplified abstract
- Chengdu boe optoelectronics technology co., ltd. (20240244877). DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND DISPLAY DEVICE simplified abstract
- Chengdu BOE Optoelectronics Technology Co., Ltd. patent applications on July 18th, 2024
G
H
I
- Intel corporation (20240105700). SILICON CARBIDE POWER DEVICES INTEGRATED WITH SILICON LOGIC DEVICES simplified abstract
- Intel corporation (20240113033). DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE simplified abstract
- Intel corporation (20240113087). HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240128162). NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION simplified abstract
- Intel corporation (20240128253). LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL simplified abstract
- Intel corporation (20240128255). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240128256). MULTI-CHIP PACKAGING simplified abstract
- Intel corporation (20240136269). ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE simplified abstract
- Intel corporation (20240136323). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240186206). INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY simplified abstract
- Intel corporation (20240213170). GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS simplified abstract
- Intel corporation (20240213235). ARCHITECTURES FOR BACKSIDE POWER DELIVERY WITH STACKED INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240215269). GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract
- Intel corporation (20240219629). PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES simplified abstract
- Intel corporation (20240222219). PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES simplified abstract
- Intel corporation (20240222279). TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE simplified abstract
- Intel corporation (20240222345). DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING simplified abstract
- Intel corporation (20240222346). ARCHITECTURES FOR MEMORY ON INTEGRATED CIRCUIT DEVICE PACKAGES simplified abstract
- Intel corporation (20240222347). MODULAR MEMORY BLOCKS FOR INTEGRATED CIRCUIT DEVICES simplified abstract
- Intel corporation (20240222350). OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES simplified abstract
- Intel corporation (20240234283). ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE simplified abstract
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on April 25th, 2024
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on January 18th, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on July 11th, 2024
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on June 6th, 2024
- Intel Corporation patent applications on March 14th, 2024
- Intel Corporation patent applications on March 28th, 2024
- International business machines corporation (20240192439). HETEROGENEOUS PACKAGE STRUCTURES WITH PHOTONIC DEVICES simplified abstract
- International business machines corporation (20240203822). THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract
- International business machines corporation (20240215270). HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION simplified abstract
- International Business Machines Corporation patent applications on February 29th, 2024
- International Business Machines Corporation patent applications on June 13th, 2024
- International Business Machines Corporation patent applications on June 20th, 2024
- International Business Machines Corporation patent applications on June 27th, 2024
K
- Kioxia corporation (20240098999). SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240099013). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240099031). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240099032). SEMICONDUCTOR STORAGE DEVICE simplified abstract
- Kioxia corporation (20240099033). SEMICONDUCTOR MEMORY DEVICE simplified abstract