Category:Hsing-Kuo Hsia

Hsing-Kuo Hsia

Executive Summary

Hsing-Kuo Hsia is an inventor who has filed 8 patents. Their primary areas of innovation include OPTICAL ELEMENTS, SYSTEMS OR APPARATUS (3 patents), OPTICAL ELEMENTS, SYSTEMS OR APPARATUS (3 patents), of the integrated circuit kind (electric integrated circuits (3 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (8 patents). Their most frequent collaborators include (8 collaborations), (6 collaborations), (3 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• G02B6/13 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 3 patents
• G02B2006/12121 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 3 patents
• G02B6/12004 (of the integrated circuit kind (electric integrated circuits): 3 patents
• G02B6/4214 (Coupling light guides with opto-electronic elements): 2 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 2 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 2 patents
• G02B6/122 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/1225 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/12019 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/4243 (Coupling light guides with opto-electronic elements): 1 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01S5/02315 (Support members, e.g. bases or carriers): 1 patents
• H01S5/0232 (Lead-frames): 1 patents
• H01S5/02345 (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
• H01S5/028 (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
• H01L2224/48225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/132 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B6/136 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L21/76898 ({formed through a semiconductor substrate}): 1 patents
• H01L25/167 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• G02B2006/12104 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49833 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• G02B2006/12061 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• G02B2006/12123 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05022 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05571 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05624 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05666 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05684 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13109 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13111 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13116 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13139 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13144 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13164 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/2919 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80357 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/0504 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/0544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/05494 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/0665 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/07025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1432 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/14361 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1437 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• G02B6/0006 (Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings): 1 patents
• G02B6/124 (of the integrated circuit kind (electric integrated circuits): 1 patents
• G02B6/4244 (Coupling light guides with opto-electronic elements): 1 patents
• G02B6/4283 (Coupling light guides with opto-electronic elements): 1 patents

Companies

List of Companies

• Taiwan Semiconductor Manufacturing Co., Ltd.: 8 patents

Collaborators

• Chen-Hua Yu (8 collaborations)
• Jui Lin Chao (6 collaborations)
• Chih-Wei Tseng (3 collaborations)
• Chih-Hao Yu (1 collaborations)
• Shih-Peng Tai (1 collaborations)
• Kuo-Chiang Ting (1 collaborations)
• Sung-Hui Huang (1 collaborations)
• Shang-Yun Hou (1 collaborations)
• Chi-Hsi Wu (1 collaborations)