US Patent Application 18448600. MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD simplified abstract
MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD
Organization Name
Inventor(s)
Martin Wilfried Heller of Kyoto (JP)
MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18448600 titled 'MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD
Simplified Explanation
The abstract describes a MEMS sensor that includes a semiconductor chip with a cavity, a frame portion, and a movable portion.
- The semiconductor chip has a first and second principal surface.
- The frame portion forms the bottom and side of the cavity.
- The movable portion is on the first principal surface and is supported by the frame portion in a floating state.
- The frame portion has a stepped surface between the bottom of the cavity and the first principal surface.
- The movable portion includes a main body portion facing the cavity and an extension portion that extends towards the upper region of the stepped surface.
- The extension portion faces the stepped surface.
Original Abstract Submitted
A MEMS sensor includes a semiconductor chip that has a first principal surface and a second principal surface and that has a cavity, a frame portion that forms a bottom portion and a side portion of the cavity, and a movable portion that is formed on the side of the first principal surface and that is supported by the frame portion in a floating state with respect to the cavity, and, in the MEMS sensor, the frame portion has a stepped surface formed at a height position between the bottom portion of the cavity and the first principal surface, and the movable portion includes a main body portion facing the cavity in a first direction and an extension portion that extends from the main body portion toward an upper region of the stepped surface in a second direction and that faces the stepped surface in the first direction.