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Create the page "H01L25/13" on this wiki! See also the search results found.

• 18244716. DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE simplified abstract (GOOGLE LLC)
  [[Category:H01L23/13]] [[Category:H01L25/16]]
  4 KB (611 words) - 17:48, 1 January 2024
• 18678813. HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract (Intel Corporation)
  [[Category:H01L23/13]] [[Category:H01L25/065]]
  4 KB (500 words) - 03:07, 1 October 2024
• 17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation)
  [[Category:H01L23/13]] [[Category:H01L25/16]]
  4 KB (591 words) - 07:30, 12 April 2024
• BOE Technology Group Co., Ltd. patent applications on October 10th, 2024
  ...[[:Category:CPC_G01T1/20182|G01T1/20182]] (1), [[:Category:CPC_H01L25/167|H01L25/167]] (1), [[:Category:CPC_H10K59/65|H10K59/65]] (1) IPC Code(s): H01L25/16, H01L23/00
  24 KB (3,813 words) - 00:33, 18 October 2024
• Samsung Display Co., LTD. patent applications on January 18th, 2024
  IPC Code(s): H01L25/075, H01L33/00 [[Category:H01L25/075]][[Category:H01L33/00]][[Category:samsung display co., ltd.]]
  40 KB (6,171 words) - 09:00, 30 January 2024
• Intel corporation (20240113029). MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract
  [[Category:H01L23/13]] [[Category:H01L25/16]]
  4 KB (577 words) - 04:09, 11 April 2024
• 18417153. Display Device and System simplified abstract (SEMICONDUCTOR ENERGY LABORATORY CO., LTD.)
  [[Category:G06V40/13]] [[Category:H01L25/18]]
  5 KB (707 words) - 03:49, 30 May 2024
• Intel corporation (20240105655). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT simplified abstract
  [[Category:H01L23/13]] [[Category:H01L25/065]]
  5 KB (693 words) - 04:15, 11 April 2024
• ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. Patent Application Trends in 2024
  * [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS) ** Count: 13 patents
  17 KB (2,210 words) - 15:11, 22 July 2024
• 3D Printing patent applications on August 29th, 2024
  ..., B22F10/18, B22F10/62, B22F10/64, B22F10/66, B22F10/80, B22F12/00, B22F12/13, B22F12/50, B22F12/90, B28B1/00, B29C64/20, B29C70/22, B29C70/38, B33Y10/00 ...y:B22F10/66]][[Category:B22F10/80]][[Category:B22F12/00]][[Category:B22F12/13]][[Category:B22F12/50]][[Category:B22F12/90]][[Category:B28B1/00]][[Categor
  16 KB (2,363 words) - 08:04, 29 August 2024
• BOE TECHNOLOGY GROUP CO., LTD. patent applications on August 1st, 2024
  .../3233]] (9), [[:Category:G06F3/041|G06F3/041]] (7), [[:Category:H01L25/075|H01L25/075]] (6) IPC Code(s): H01L25/075, H01L21/68, H01L33/00
  30 KB (4,825 words) - 04:56, 5 August 2024
• EPISTAR CORPORATION Patent Application Trends in 2024
  * [[:Category:CPC_H01L25/0753|H01L25/0753]] (the devices being of a type provided for in group) * [[:Category:CPC_H01L25/0756|H01L25/0756]] (the devices being of a type provided for in group)
  10 KB (1,215 words) - 16:50, 18 July 2024
• Tianma Advanced Display Technology Institute (Xiamen) Co., Ltd. Patent Application Trends in 2024
  * [[:Category:CPC_H01L25/0753|H01L25/0753]] (the devices being of a type provided for in group) * [[:Category:CPC_H01L25/167|H01L25/167]] (the devices being of types provided for in two or more different mai
  11 KB (1,431 words) - 16:10, 19 July 2024
• SK hynix Inc. patent applications on August 8th, 2024
  IPC Code(s): G06V10/75, G06T7/13, G06V10/56 ...ure region and a non-texture region.[[Category:G06V10/75]][[Category:G06T7/13]][[Category:G06V10/56]][[Category:CPC_G06V10/751]][[Category:sk hynix inc.]
  23 KB (3,690 words) - 05:30, 13 August 2024
• Intel corporation (20240321762). HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract
  [[Category:H01L23/13]] [[Category:H01L25/065]]
  5 KB (618 words) - 08:20, 26 September 2024
• LG Display Co., Ltd. patent applications on August 29th, 2024
  ...1L25/16]] (9), [[:Category:G09G3/32|G09G3/32]] (9), [[:Category:H01L25/075|H01L25/075]] (7), [[:Category:H10K59/131|H10K59/131]] (7) IPC Code(s): G06F1/16, G06F1/20, H01L25/075
  47 KB (7,671 words) - 09:35, 5 September 2024
• BOE TECHNOLOGY GROUP CO., LTD. patent applications on July 11th, 2024
  IPC Code(s): G06V10/44, G06T5/20, G06T5/73, G06T7/11, G06T7/13, G06V10/771, G06V10/80 ...egory:G06T5/20]][[Category:G06T5/73]][[Category:G06T7/11]][[Category:G06T7/13]][[Category:G06V10/771]][[Category:G06V10/80]][[Category:CPC_G06V10/44]][[C
  29 KB (4,672 words) - 07:18, 11 July 2024
• Adeia Semiconductor Bonding Technologies Inc. Patent Application Trends in 2024
  * [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS) ** Count: 13 patents
  17 KB (2,224 words) - 03:31, 29 July 2024
• SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
  ** Count: 13 patents * [[:Category:CPC_H01L25/072|H01L25/072]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
  21 KB (2,842 words) - 15:39, 21 July 2024
• Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
  * [[:Category:CPC_H01L25/0657|H01L25/0657]] (No explanation available) * [[:Category:CPC_H01L25/50|H01L25/50]] (No explanation available)
  20 KB (2,707 words) - 06:14, 16 July 2024

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