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  • Micron Technology, Inc. patent applications on May 30th, 2024
    IPC Code(s): G11C29/46, G11C29/12, G11C29/42 [[Category:G11C29/46]][[Category:G11C29/12]][[Category:G11C29/42]][[Category:micron technology,
    57 KB (8,986 words) - 08:03, 31 May 2024
  • Intel Corporation patent applications on June 6th, 2024
    ...he areas of [[:Category:H01L23/00|H01L23/00]] (11), [[:Category:H01L23/498|H01L23/498]] (7), [[:Category:H01L21/48|H01L21/48]] (7), [[:Category:H04W72/232|H0 IPC Code(s): G01R19/00, G01R19/25, G05F1/46
    90 KB (13,613 words) - 02:24, 10 June 2024
  • Patent Applications Report for 28th Jun 2024
    ...0]] (10), [[:Category:H01L23/498|H01L23/498]] (10), [[:Category:H01L23/538|H01L23/538]] (9), [[:Category:H01L25/065|H01L25/065]] (8), [[:Category:G06F9/30|G0 [[:Category:CPC_H01L23/5389|H01L23/5389]] (3), [[:Category:CPC_G06F9/30145|G06F9/30145]] (2), [[:Category:CPC_
    62 KB (7,769 words) - 06:05, 29 June 2024
  • HYUNDAI MOTOR COMPANY patent applications on April 11th, 2024
    IPC Code(s): H01L23/498, H01L21/48, H01L23/00, H01L23/373 ...ategory:H01L23/498]][[Category:H01L21/48]][[Category:H01L23/00]][[Category:H01L23/373]][[Category:hyundai motor company]]
    43 KB (6,819 words) - 08:55, 12 April 2024
  • Patent Applications Report for 14th Jun 2024
    ...the areas of [[:Category:H04W52/36|H04W52/36]] (4), [[:Category:H01L23/00|H01L23/00]] (4), [[:Category:G06F21/60|G06F21/60]] (4), [[:Category:H04L5/00|H04L5 ...12/00]] (10), [[:Category:H10B80/00|H10B80/00]] (9), [[:Category:H01L23/31|H01L23/31]] (8)
    60 KB (7,670 words) - 05:19, 14 June 2024
  • Intel Corporation patent applications on April 11th, 2024
    IPC Code(s): H01L23/00, H01L23/498 ...ads on a surface of the electronic device.[[Category:H01L23/00]][[Category:H01L23/498]][[Category:intel corporation]]
    48 KB (7,150 words) - 09:00, 12 April 2024
  • INTEL CORPORATION patent applications on February 8th, 2024
    IPC Code(s): G06F13/16, G06F12/0817, H04L12/46, C07F15/00, G06F12/0831, G06F12/1018, H04L49/90 ...operation.[[Category:G06F13/16]][[Category:G06F12/0817]][[Category:H04L12/46]][[Category:C07F15/00]][[Category:G06F12/0831]][[Category:G06F12/1018]][[Ca
    64 KB (9,638 words) - 04:09, 9 February 2024
  • Micron Technology, Inc. patent applications on February 1st, 2024
    IPC Code(s): G11C29/46, G11C29/42, G11C7/10 ...st based on setting the first dmi bit to the first value.[[Category:G11C29/46]][[Category:G11C29/42]][[Category:G11C7/10]][[Category:micron technology, i
    51 KB (7,882 words) - 04:26, 2 February 2024
  • Intel Corporation patent applications on May 16th, 2024
    IPC Code(s): G06N3/08, G06F9/46, G06N3/044, G06N3/045, G06N3/063, G06N3/084, G06N5/04, G06T15/00 ...data and the per-layer scale factor.[[Category:G06N3/08]][[Category:G06F9/46]][[Category:G06N3/044]][[Category:G06N3/045]][[Category:G06N3/063]][[Catego
    59 KB (9,008 words) - 01:21, 24 May 2024
  • Patent Applications Report for 21st Jun 2024
    ..., [[:Category:CPC_H01L23/5226|H01L23/5226]] (2), [[:Category:CPC_H01L23/15|H01L23/15]] (2), [[:Category:CPC_G02B6/3636|G02B6/3636]] (1) .../065]] (19), [[:Category:H01L23/31|H01L23/31]] (11), [[:Category:H01L23/48|H01L23/48]] (9), [[:Category:H01L29/06|H01L29/06]] (7)
    62 KB (7,827 words) - 16:59, 21 June 2024
  • Hyundai Motor Company patent applications on April 18th, 2024
    IPC Code(s): B60L15/00, H01L23/495, H02M3/00, H05K7/10 ...ed on the other side of the circuit board.[[Category:B60L15/00]][[Category:H01L23/495]][[Category:H02M3/00]][[Category:H05K7/10]][[Category:hyundai motor com
    74 KB (11,780 words) - 03:00, 26 April 2024
  • HYUNDAI MOTOR COMPANY patent applications on June 6th, 2024
    IPC Code(s): C04B38/00, C04B35/46, H01M4/88 ...ained after completion of reaction.[[Category:C04B38/00]][[Category:C04B35/46]][[Category:H01M4/88]][[Category:hyundai motor company]]
    53 KB (8,371 words) - 03:34, 10 June 2024
  • CANON KABUSHIKI KAISHA patent applications on March 28th, 2024
    ...AISHA has applied for patents in the areas of [[:Category:H04N19/46|H04N19/46]] (8), [[:Category:H04N19/119|H04N19/119]] (6), [[:Category:G03G15/00|G03G1 IPC Code(s): H01L23/58, H01L23/00, H04N1/23
    91 KB (13,694 words) - 04:46, 11 April 2024
  • ADVANCED MICRO DEVICES, INC. patent applications on April 4th, 2024
    IPC Code(s): H01L23/498, H01L23/00 ...ion cantilevered from the interposer die.[[Category:H01L23/498]][[Category:H01L23/00]][[Category:advanced micro devices, inc.]]
    61 KB (9,394 words) - 08:32, 11 April 2024
  • Kioxia Corporation patent applications on March 21st, 2024
    IPC Code(s): G11C16/04, H01L23/528, H10B41/10, H10B41/27, H10B41/35, H10B43/10, H10B43/27, H10B43/35 ...nterconnect layer in the second direction.[[Category:G11C16/04]][[Category:H01L23/528]][[Category:H10B41/10]][[Category:H10B41/27]][[Category:H10B41/35]][[Ca
    109 KB (16,683 words) - 07:41, 22 March 2024
  • Micron Technology, Inc. patent applications on June 6th, 2024
    [[:Category:Micron Technology, Inc.|Micron Technology, Inc.]]: 46 patent applications[[Category:Micron Technology, Inc.]] ...C16/10]] (5), [[:Category:G11C16/34|G11C16/34]] (5), [[:Category:H01L23/00|H01L23/00]] (4), [[:Category:H01L33/48|H01L33/48]] (4)
    59 KB (9,250 words) - 04:24, 10 June 2024
  • HUAWEI TECHNOLOGIES CO., LTD. patent applications on May 30th, 2024
    IPC Code(s): H01L23/48, H01L21/768, H01L23/00, H01L23/522, H01L25/065 ...ategory:H01L23/48]][[Category:H01L21/768]][[Category:H01L23/00]][[Category:H01L23/522]][[Category:H01L25/065]][[Category:huawei technologies co., ltd.]]
    84 KB (12,731 words) - 07:17, 31 May 2024
  • Patent Applications Report for 8th Dec 2023
    ...:Category:H01L27/092|H01L27/092]] (7 applications), [[:Category:H01L23/498|H01L23/498]] (5 applications), [[:Category:H01L25/065|H01L25/065]] (5 applications [[:Category:SAMSUNG DISPLAY CO., LTD.|SAMSUNG DISPLAY CO., LTD.]]: 46 patent applications[[Category:SAMSUNG DISPLAY CO., LTD.]]
    37 KB (4,531 words) - 10:00, 7 December 2023
  • Patent Applications Report for 20th Jan 2023
    ...f [[:Category:G06F3/06|G06F3/06]] (14 applications), [[:Category:H01L23/00|H01L23/00]] (13 applications), [[:Category:G06F3/0604|G06F3/0604]] (9 applications [[:Category:Intel Corporation|Intel Corporation]]: 46 patent applications[[Category:Intel Corporation]]
    38 KB (4,621 words) - 01:18, 2 January 2024
  • Patent Applications Report for 21st Apr 2023
    ...:Category:H01L25/065|H01L25/065]] (12 applications), [[:Category:H01L23/00|H01L23/00]] (11 applications), [[:Category:H01L27/11582|H01L27/11582]] (9 applicat [[:Category:LG ELECTRONICS INC.|LG ELECTRONICS INC.]]: 46 patent applications[[Category:LG ELECTRONICS INC.]]
    36 KB (4,472 words) - 18:27, 2 January 2024

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