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Create the page "H05K1/00" on this wiki! See also the search results found.

• 18612282. PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
  [[Category:H05K1/02]] [[Category:H01L23/00]]
  4 KB (505 words) - 15:47, 30 September 2024
• 18373776. CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
  [[Category:H05K5/00]] [[Category:H05K1/11]]
  4 KB (576 words) - 06:43, 22 March 2024
• Canon kabushiki kaisha (20240260167). ELECTRONIC MODULE, IMAGING UNIT AND EQUIPMENT simplified abstract
  [[Category:H05K1/02]] [[Category:H01L23/00]]
  4 KB (582 words) - 04:38, 5 August 2024
• Samsung electronics co., ltd. (20240098912). CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract
  [[Category:H05K5/00]] [[Category:H05K1/11]]
  4 KB (571 words) - 09:38, 21 March 2024
• CILAG GMBH INTERNATIONAL (20240307130). METHOD OF CLOUD BASED DATA ANALYTICS FOR USE WITH THE HUB simplified abstract
  [[Category:A61B34/00]] [[Category:A61B1/00]]
  6 KB (857 words) - 06:40, 19 September 2024
• 17914235. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (Chengdu BOE Optoelectronics Technology Co., Ltd.)
  [[Category:H01L23/00]] [[Category:H05K1/02]]
  4 KB (635 words) - 05:27, 28 June 2024
• Samsung electronics co., ltd. (20240306354). ELECTRONIC DEVICE INCLUDING SHIELDING STRUCTURE FOR REDUCING MOUNTING VOLUME OF COMPONENT simplified abstract
  [[Category:H05K9/00]] [[Category:H05K1/02]]
  4 KB (563 words) - 06:43, 12 September 2024
• Samsung electronics co., ltd. (20240324094). PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME simplified abstract
  [[Category:H05K1/02]] [[Category:H01L23/00]]
  4 KB (552 words) - 05:34, 27 September 2024
• 18679711. CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
  [[Category:H05K1/02]] [[Category:H05K1/14]]
  4 KB (600 words) - 01:58, 1 October 2024
• 18560149. CIRCUITRY PACKAGE FOR POWER APPLICATIONS simplified abstract (Telefonaktiebolaget LM Ericsson (publ))
  [[Category:H01L23/00]] [[Category:H05K1/02]]
  4 KB (540 words) - 06:56, 20 July 2024
• 20240014794. Impedence Matching Conductive Structure for High Efficiency RF Circuits simplified abstract (3D Glass Solutions, Inc.)
  [[Category:H05K1/02]] [[Category:H05K1/03]]
  3 KB (491 words) - 05:19, 12 January 2024
• 20240049388. SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS simplified abstract (DexCom, Inc.)
  [[Category:H05K1/11]] [[Category:A61B5/00]]
  4 KB (631 words) - 03:57, 9 February 2024
• Intel corporation (20240321762). HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract
  [[Category:H01L23/00]] [[Category:H05K1/03]]
  5 KB (618 words) - 08:20, 26 September 2024
• 18526964. SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Lodestar Licensing Group LLC)
  [[Category:H01L23/00]] [[Category:H05K1/02]]
  4 KB (536 words) - 05:40, 6 June 2024
• 17818722. ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE ELECTRIC DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
  [[Category:H05K1/11]] [[Category:H05K1/18]]
  4 KB (599 words) - 17:38, 1 January 2024
• Intel corporation (20240188212). PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING simplified abstract
  [[Category:H05K1/02]] [[Category:H01L23/00]]
  4 KB (588 words) - 02:23, 10 June 2024
• Chengdu boe optoelectronics technology co., ltd. (20240213181). DISPLAY PANEL AND DISPLAY DEVICE simplified abstract
  [[Category:H01L23/00]] [[Category:H05K1/02]]
  4 KB (668 words) - 02:54, 28 June 2024
• 18663314. PATTERNED CONDUCTIVE ARTICLE simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
  [[Category:H05K1/02]] [[Category:H05K1/03]]
  4 KB (597 words) - 07:48, 19 September 2024
• Telefonaktiebolaget lm ericsson (publ) (20240243043). CIRCUITRY PACKAGE FOR POWER APPLICATIONS simplified abstract
  [[Category:H01L23/00]] [[Category:H05K1/02]]
  4 KB (584 words) - 03:28, 19 July 2024
• Dell products l.p. (20240284587). ROUGHNESS EDGE OF A HEAT SINK simplified abstract
  [[Category:H05K1/02]] [[Category:H05K1/18]]
  4 KB (594 words) - 07:59, 22 August 2024

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