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Create the page "H01L25/13" on this wiki! See also the search results found.

• 18586407. ELECTRONIC DEVICE WITH MICRO-PHOTOELECTRIC UNITS simplified abstract (LG Display Co., Ltd.)
  [[Category:G06V40/13]] [[Category:H01L25/04]]
  4 KB (503 words) - 07:24, 14 June 2024
• 18735126. PACKAGE STRUCTURE INCLUDING STACKED PILLAR PORTIONS AND METHOD FOR FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
  [[Category:H01L25/065]] [[Category:CPC_H01L24/13]]
  4 KB (509 words) - 02:11, 1 October 2024
• Taiwan semiconductor manufacturing company, ltd. (20240321796). PACKAGE STRUCTURE INCLUDING STACKED PILLAR PORTIONS AND METHOD FOR FABRICATING THE SAME simplified abstract
  [[Category:H01L25/065]] [[Category:CPC_H01L24/13]]
  4 KB (528 words) - 07:08, 27 September 2024
• 18092504. INPUT SENSING DEVICE AND A DISPLAY DEVICE INCLUDING THE SAME simplified abstract (Samsung Display Co., Ltd.)
  [[Category:H01L25/16]] [[Category:G06V40/13]]
  4 KB (608 words) - 02:13, 4 January 2024
• NANYA TECHNOLOGY CORPORATION patent applications on February 8th, 2024
  IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L23/13, H01L21/48 ...:H01L23/498]][[Category:H01L23/00]][[Category:H01L23/31]][[Category:H01L23/13]][[Category:H01L21/48]][[Category:nanya technology corporation]]
  40 KB (5,792 words) - 04:10, 9 February 2024
• 18467062. PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
  [[Category:H01L25/16]] [[Category:H01L23/13]]
  4 KB (594 words) - 11:11, 5 January 2024
• 17937764. TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE simplified abstract (International Business Machines Corporation)
  [[Category:H01L23/13]] [[Category:H01L25/065]]
  4 KB (478 words) - 08:38, 12 April 2024
• 18240576. SEMICONDUCTOR MODULE simplified abstract (Samsung Electronics Co., Ltd.)
  [[Category:H01L23/13]] [[Category:H01L25/065]]
  4 KB (559 words) - 05:56, 13 August 2024
• Samsung electronics co., ltd. (20240266305). SEMICONDUCTOR MODULE simplified abstract
  [[Category:H01L23/13]] [[Category:H01L25/065]]
  4 KB (549 words) - 06:42, 8 August 2024
• 17735747. DEVICE TRANSFER SUBSTRATE, DEVICE TRANSFER STRUCTURE, AND DISPLAY APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
  [[Category:H01L25/13]]
  4 KB (566 words) - 02:24, 3 January 2024
• 18442484. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Japan Display Inc.)
  [[Category:H01L25/16]] [[Category:CPC_H01L24/13]]
  4 KB (606 words) - 04:46, 23 August 2024
• 18618055. Photonic Semiconductor Device and Method of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
  [[Category:H01L25/16]] [[Category:G02B6/13]]
  4 KB (622 words) - 06:33, 13 August 2024
• International business machines corporation (20240112965). TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE simplified abstract
  [[Category:H01L23/13]] [[Category:H01L25/065]]
  4 KB (515 words) - 04:56, 11 April 2024
• Lg display co., ltd. (20240194721). ELECTRONIC DEVICE WITH MICRO-PHOTOELECTRIC UNITS simplified abstract
  [[Category:G06V40/13]] [[Category:H01L25/04]]
  4 KB (526 words) - 05:03, 14 June 2024
• Samsung electronics co., ltd. (20240213199). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
  [[Category:H01L25/065]] [[Category:CPC_H01L24/13]]
  5 KB (693 words) - 00:53, 28 June 2024
• 17849352. COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES simplified abstract (Intel Corporation)
  [[Category:H01L25/16]] [[Category:H01L23/13]]
  4 KB (540 words) - 05:53, 1 January 2024
• Samsung electronics co., ltd. (20240105694). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
  [[Category:H01L25/16]] [[Category:H01L23/13]]
  4 KB (596 words) - 07:10, 10 April 2024
• 18544191. AUTHENTICATION SYSTEM AND METHOD FOR RECORDING UNLOCKING HISTORY USING AUTHENTICATION SYSTEM simplified abstract (SEMICONDUCTOR ENERGY LABORATORY CO., LTD.)
  [[Category:G06V40/13]] [[Category:H01L25/16]]
  4 KB (568 words) - 07:06, 28 June 2024
• WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2024
  * [[:Category:CPC_H01L25/0652|H01L25/0652]] (No explanation available) * [[:Category:CPC_H01L25/50|H01L25/50]] (No explanation available)
  10 KB (1,291 words) - 05:22, 18 July 2024
• ROHM CO., LTD. patent applications on August 22nd, 2024
  [[:Category:CPC_H01L25/0655|H01L25/0655]] (2), [[:Category:CPC_H01L23/49541|H01L23/49541]] (2), [[:Category:CP ...3/00, H01L23/31, H01L23/373, H01L23/498, H01L23/538, H01L25/07, H01L25/11, H01L25/18, H02M7/00
  32 KB (5,154 words) - 08:04, 22 August 2024

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