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• SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
  ...has applied for patents in the areas of [[:Category:H01L23/00|H01L23/00]] (22), [[:Category:H04W76/27|H04W76/27]] (12), [[:Category:H10B80/00|H10B80/00]] IPC Code(s): H01L29/78, H01L21/768, H01L21/22, H01L21/762, H10B12/00, H10B41/00, H10B43/00
  286 KB (44,135 words) - 04:08, 9 February 2024
• Blockchain patent applications on February 15th, 2024
  IPC Code(s): A23J3/22, A23J3/14, A23J3/26, A61K47/42 [[Category:A23J3/22]][[Category:A23J3/14]][[Category:A23J3/26]][[Category:A61K47/42]][[Category
  300 KB (42,769 words) - 03:16, 19 February 2024
• Blockchain patent applications on February 1st, 2024
  IPC Code(s): A23L15/00, A23J1/14, A23J3/14, A23J3/22 ...gory:A23L15/00]][[Category:A23J1/14]][[Category:A23J3/14]][[Category:A23J3/22]][[Category:Unknown Organization]]
  313 KB (44,738 words) - 04:14, 2 February 2024

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