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Create the page "H01L29/73" on this wiki! See also the search results found.

  • Patent Applications Report for 1st Mar 2024
    ...gory:H04N19/176|H04N19/176]] (10 applications), [[:Category:G06T7/73|G06T7/73]] (9 applications) ...[[:Category:H01L21/56|H01L21/56]] (19 applications), [[:Category:H01L29/66|H01L29/66]] (17 applications), [[:Category:H01L23/31|H01L23/31]] (16 applications)
    45 KB (5,535 words) - 03:18, 4 March 2024
  • CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. Patent Application Trends in 2024
    * [[:Category:CPC_H01L29/78645|H01L29/78645]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS) * [[:Category:CPC_H01L29/41733|H01L29/41733]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
    17 KB (2,287 words) - 09:07, 19 July 2024
  • Micron Technology, Inc. patent applications on September 12th, 2024
    IPC Code(s): H01L29/417, H01L29/40 CPC Code(s): H01L29/41775
    48 KB (7,526 words) - 02:53, 19 September 2024
  • Patent Applications Report for 27th Oct 2023
    ...[:Category:H01L29/06|H01L29/06]] (7 applications), [[:Category:H01L29/0673|H01L29/0673]] (7 applications) ...:Category:H01L21/768|H01L21/768]] (14 applications), [[:Category:H01L29/78|H01L29/78]] (9 applications), [[:Category:H01L23/00|H01L23/00]] (9 applications),
    28 KB (3,550 words) - 04:06, 4 December 2023
  • Patent Applications Report for 12th Jul 2024
    [[:Category:Intel Corporation|Intel Corporation]]: 73 patent applications[[Category:Intel Corporation]] ...23]] (17), [[:Category:H01L25/065|H01L25/065]] (15), [[:Category:H01L29/06|H01L29/06]] (14)
    61 KB (7,778 words) - 09:36, 11 July 2024
  • Purdue Research Foundation Patent Application Trends in 2024
    * [[:Category:CPC_H01L29/1608|H01L29/1608]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS) * [[:Category:CPC_H01L29/42364|H01L29/42364]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
    26 KB (3,640 words) - 01:00, 19 July 2024
  • Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
    ...the areas of [[:Category:H01L29/66|H01L29/66]] (19), [[:Category:H01L29/06|H01L29/06]] (17), [[:Category:H01L23/00|H01L23/00]] (12), [[:Category:H01L21/8234| [[:Category:CPC_H01L29/0673|H01L29/0673]] (3), [[:Category:CPC_H01L23/5389|H01L23/5389]] (2), [[:Category:CPC_
    109 KB (15,779 words) - 08:18, 8 August 2024
  • Patent Applications Report for 7th Apr 2023
    ...[[:Category:H01L29/66|H01L29/66]] (6 applications), [[:Category:H01L29/786|H01L29/786]] (4 applications), [[:Category:G06F11/36|G06F11/36]] (4 applications) ...acturing Co., Ltd. has filed patents in the areas of [[:Category:H01L29/66|H01L29/66]] (12 applications), [[:Category:H01L21/56|H01L21/56]] (10 applications)
    35 KB (4,315 words) - 17:46, 2 January 2024
  • Patent Applications Report for 9th Feb 2024
    ...tegory:H01L27/092|H01L27/092]] (11 applications), [[:Category:H01L29/66545|H01L29/66545]] (10 applications) [[:Category:H01L29/66|H01L29/66]]: 71
    46 KB (5,558 words) - 04:10, 9 February 2024
  • Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
    * [[:Category:CPC_H01L29/66545|H01L29/66545]] ({using a dummy, i.e. replacement gate in a process wherein at leas * [[:Category:CPC_H01L29/66795|H01L29/66795]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
    48 KB (6,497 words) - 01:37, 19 July 2024
  • Patent Applications Report for 16th Jun 2023
    ...Category:H01L29/66|H01L29/66]] (13 applications), [[:Category:H01L29/42392|H01L29/42392]] (12 applications) ...[[:Category:G06F21/53|G06F21/53]] (6 applications), [[:Category:H01L29/423|H01L29/423]] (6 applications)
    37 KB (4,510 words) - 08:58, 4 January 2024
  • Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
    * [[:Category:CPC_H01L29/66545|H01L29/66545]] ({using a dummy, i.e. replacement gate in a process wherein at leas * [[:Category:CPC_H01L29/66795|H01L29/66795]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
    48 KB (6,537 words) - 06:47, 18 July 2024
  • Patent Applications Report for 5th Apr 2024
    ...of patent applications containing 'Audio Technologies' or its variations: 73 ...:Category:H01L21/48|H01L21/48]] (15 applications), [[:Category:H01L29/0673|H01L29/0673]] (13 applications)
    48 KB (5,854 words) - 07:18, 12 April 2024
  • Patent Applications Report for 21st Jun 2024
    ...29/423]] (5), [[:Category:H01L29/20|H01L29/20]] (5), [[:Category:H01L29/40|H01L29/40]] (5) ...23/31]] (11), [[:Category:H01L23/48|H01L23/48]] (9), [[:Category:H01L29/06|H01L29/06]] (7)
    62 KB (7,827 words) - 16:59, 21 June 2024
  • Patent Applications Report for 20th Sep 2024
    ...T1/20]] (5), [[:Category:G06T15/04|G06T15/04]] (3), [[:Category:H01L29/775|H01L29/775]] (3), [[:Category:H05K1/02|H05K1/02]] (3) ...Category:H01L27/092|H01L27/092]] (20 applications), [[:Category:H01L29/786|H01L29/786]] (18 applications)
    86 KB (10,634 words) - 09:37, 19 September 2024
  • BOE Technology Group Co., Ltd. patent applications on July 18th, 2024
    IPC Code(s): G06T17/00, G06T5/50, G06T7/73, G06T13/40, G06T19/20, G06V40/10, G06V40/16 ...man body model.[[Category:G06T17/00]][[Category:G06T5/50]][[Category:G06T7/73]][[Category:G06T13/40]][[Category:G06T19/20]][[Category:G06V40/10]][[Catego
    46 KB (7,384 words) - 06:28, 18 July 2024
  • KABUSHIKI KAISHA TOSHIBA Patent Application Trends in 2024
    * [[:Category:CPC_H01L29/7813|H01L29/7813]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS) * [[:Category:CPC_H01L29/2003|H01L29/2003]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
    41 KB (5,767 words) - 07:33, 18 July 2024
  • Patent Applications Report for 27th Sep 2024
    ...9/06]] (6), [[:Category:H01L29/423|H01L29/423]] (5), [[:Category:H01L29/66|H01L29/66]] (4), [[:Category:H01L23/498|H01L23/498]] (4) ...5]] (21), [[:Category:H01L23/498|H01L23/498]] (21), [[:Category:H01L29/423|H01L29/423]] (20), [[:Category:H10B80/00|H10B80/00]] (18)
    85 KB (10,519 words) - 09:20, 27 September 2024
  • Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024
    ...06]] (18), [[:Category:H01L21/768|H01L21/768]] (15), [[:Category:H01L29/78|H01L29/78]] (14) ...[:Category:CPC_H01L29/42392|H01L29/42392]] (2), [[:Category:CPC_H01L29/785|H01L29/785]] (2), [[:Category:CPC_H01L23/5283|H01L23/5283]] (2)
    135 KB (19,652 words) - 07:12, 27 September 2024
  • Rohm Co., Ltd. Patent Application Trends in 2024
    * [[:Category:CPC_H01L24/73|H01L24/73]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS) * [[:Category:CPC_H01L29/7813|H01L29/7813]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
    35 KB (4,778 words) - 16:51, 22 July 2024

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