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  • Applied Materials, Inc. patent applications on August 8th, 2024
    IPC Code(s): G02B1/14, B05D1/00, B05D7/22, C23C16/04, G02B3/00 ....[[Category:G02B1/14]][[Category:B05D1/00]][[Category:B05D7/22]][[Category:C23C16/04]][[Category:G02B3/00]][[Category:CPC_G02B1/14]][[Category:applied materi
    35 KB (5,284 words) - 06:57, 11 August 2024
  • HONEYWELL INTERNATIONAL INC. patent applications on August 22nd, 2024
    ...4B41/45, C04B35/83, C04B41/50, C04B41/52, C04B41/87, C04B41/89, C23C16/26, C23C16/56 ...Category:C04B41/87]][[Category:C04B41/89]][[Category:C23C16/26]][[Category:C23C16/56]][[Category:CPC_C04B41/4558]][[Category:honeywell international inc.]]
    26 KB (3,855 words) - 09:36, 22 August 2024
  • Shin-Etsu Chemical Co., Ltd. Patent Application Trends in 2024
    * [[:Category:CPC_C23C16/4486|C23C16/4486]] (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; * [[:Category:CPC_C23C4/06|C23C4/06]] (Metallic material)
    22 KB (2,968 words) - 06:09, 19 July 2024
  • Samsung Display Co., LTD. patent applications on July 18th, 2024
    IPC Code(s): B32B17/06, B32B7/12, H05K5/03 CPC Code(s): B32B17/06
    88 KB (13,864 words) - 03:03, 19 July 2024
  • 3D Printing patent applications on August 1st, 2024
    IPC Code(s): C22C21/06, B22F10/64, B33Y10/00, B33Y40/20, B33Y70/00 CPC Code(s): C22C21/06
    25 KB (3,615 words) - 15:59, 3 August 2024
  • Patent Applications Report for 3rd Feb 2023
    ...gory:H01L29/66|H01L29/66]] (22 applications), [[:Category:H01L29/06|H01L29/06]] (15 applications), [[:Category:H01L29/423|H01L29/423]] (13 applications), ...gory:G06N20/00|G06N20/00]] (14 applications), [[:Category:H04L29/06|H04L29/06]] (8 applications), [[:Category:H04N7/15|H04N7/15]] (8 applications), [[:Ca
    39 KB (4,880 words) - 03:14, 2 January 2024
  • Patent Applications Report for 31st Mar 2023
    ...] (2), [[:Category:G10L17/18|G10L17/18]] (2), [[:Category:G10L17/06|G10L17/06]] (2) ...ategory:H04W72/04|H04W72/04]] (9 applications), [[:Category:G06F3/06|G06F3/06]] (8 applications), [[:Category:H01L27/108|H01L27/108]] (7 applications)
    36 KB (4,396 words) - 17:07, 2 January 2024
  • Samsung Display Co., LTD. patent applications on August 8th, 2024
    ...(9), [[:Category:H10K59/122|H10K59/122]] (8), [[:Category:C09K11/06|C09K11/06]] (7) IPC Code(s): B32B3/02, B32B3/04, B32B5/18, B32B27/06, H05K7/20
    104 KB (16,407 words) - 08:04, 8 August 2024
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
    ..., [[:Category:H01L21/8234|H01L21/8234]] (20), [[:Category:H01L29/06|H01L29/06]] (17), [[:Category:H01L27/088|H01L27/088]] (16), [[:Category:H01L29/66545| IPC Code(s): C23C16/455, C23C16/40, C23C16/44, C23C16/505, C23C16/56
    105 KB (15,276 words) - 04:53, 11 April 2024
  • Patent Applications Report for 2nd Jun 2023
    ...Category:G06N3/08|G06N3/08]] (14 applications), [[:Category:G06F3/06|G06F3/06]] (10 applications), [[:Category:H01L27/11573|H01L27/11573]] (9 application ...tegory:H04W72/04|H04W72/04]] (11 applications), [[:Category:H04B7/06|H04B7/06]] (10 applications)
    37 KB (4,456 words) - 06:02, 4 January 2024
  • HYUNDAI MOTOR COMPANY patent applications on April 11th, 2024
    IPC Code(s): B01J21/06, B01D53/88, B01J21/08, B01J23/04, B01J23/10, B01J23/72, B01J29/072, B01J35/ ...tion metal particles by coating a photocatalyst material.[[Category:B01J21/06]][[Category:B01D53/88]][[Category:B01J21/08]][[Category:B01J23/04]][[Catego
    43 KB (6,819 words) - 08:55, 12 April 2024
  • Patent Applications Report for 22nd Mar 2024
    ...as of [[:Category:G06V10/82|G06V10/82]] (10), [[:Category:G06T15/06|G06T15/06]] (8), [[:Category:G06T1/20|G06T1/20]] (4), [[:Category:G06T7/20|G06T7/20]] ...ry:H01L29/775|H01L29/775]] (20 applications), [[:Category:H01L29/06|H01L29/06]] (14 applications), [[:Category:H01L23/00|H01L23/00]] (13 applications), [
    49 KB (5,967 words) - 08:04, 22 March 2024
  • Patent Applications Report for 27th Jan 2023
    IPC Code(s): B61L25/02, B61L23/06 ...gory:H01L23/00|H01L23/00]] (12 applications), [[:Category:H01L29/06|H01L29/06]] (12 applications), [[:Category:H01L29/786|H01L29/786]] (12 applications),
    37 KB (4,657 words) - 02:13, 2 January 2024
  • Samsung Display Co., Ltd. patent applications on June 20th, 2024
    IPC Code(s): C09K11/06, H10K50/115 CPC Code(s): C09K11/06
    82 KB (12,971 words) - 16:16, 21 June 2024
  • Patent Applications Report for 26th Jul 2024
    [[:Category:CPC_H04W12/06|H04W12/06]] (2), [[:Category:CPC_H04B1/40|H04B1/40]] (2), [[:Category:CPC_H04W24/10|H ...[:Category:CPC_G06T13/40|G06T13/40]] (1), [[:Category:CPC_G06T15/06|G06T15/06]] (1)
    84 KB (10,597 words) - 08:29, 25 July 2024
  • Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
    ...1), [[:Category:H01L27/092|H01L27/092]] (11), [[:Category:H01L29/06|H01L29/06]] (10) ...3C14/06, C23C14/08, C23C14/22, C23C16/02, C23C16/04, C23C16/30, C23C16/40, C23C16/455, H01J37/32, H01L21/033, H01L21/308, H01L21/311, H01L21/768, H01L21/8238
    105 KB (15,373 words) - 07:11, 22 August 2024
  • Patent Applications Report for 6th Sep 2024
    ...0]] (2), [[:Category:H04W52/02|H04W52/02]] (2), [[:Category:H04B7/06|H04B7/06]] (2) ...] (1), [[:Category:G10L13/10|G10L13/10]] (1), [[:Category:G10L15/06|G10L15/06]] (1), [[:Category:G06N20/00|G06N20/00]] (1)
    84 KB (10,430 words) - 08:19, 9 September 2024
  • Patent Applications Report for 13th Sep 2024
    [[:Category:CPC_B25J9/163|B25J9/163]] (2), [[:Category:CPC_G06T15/06|G06T15/06]] (2), [[:Category:CPC_G06T7/50|G06T7/50]] (1), [[:Category:CPC_H04L47/35|H ...gory:CPC_H01L23/49838|H01L23/49838]] (1), [[:Category:CPC_H04W12/06|H04W12/06]] (1), [[:Category:CPC_H04W8/02|H04W8/02]] (1), [[:Category:CPC_H04N19/103|
    84 KB (10,466 words) - 04:06, 19 September 2024
  • SAMSUNG DISPLAY CO., LTD. patent applications on August 15th, 2024
    IPC Code(s): C07F5/02, C09K11/06, H10K50/11, H10K85/60 ...ompound represented by formula 2-3b:[[Category:C07F5/02]][[Category:C09K11/06]][[Category:H10K50/11]][[Category:H10K85/60]][[Category:CPC_C07F5/02]][[Cat
    105 KB (16,510 words) - 01:56, 22 August 2024
  • Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
    ...(19), [[:Category:H01L23/00|H01L23/00]] (15), [[:Category:H01L29/06|H01L29/06]] (14), [[:Category:H01L27/092|H01L27/092]] (11), [[:Category:H01L29/66545| IPC Code(s): C23C16/40, C23C16/455
    101 KB (14,590 words) - 04:09, 9 February 2024

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