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• Blockchain patent applications on March 14th, 2024
  IPC Code(s): H01L27/02, H01L21/762, H01L27/06 [[Category:H01L27/02]][[Category:H01L21/762]][[Category:H01L27/06]][[Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPAN
  369 KB (52,527 words) - 02:32, 20 March 2024
• Blockchain patent applications on March 28th, 2024
  IPC Code(s): G01N27/414, G01N33/569, H01L21/762 [[Category:G01N27/414]][[Category:G01N33/569]][[Category:H01L21/762]][[Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]
  330 KB (47,230 words) - 07:00, 10 April 2024

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