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• 18301462. Methods of Forming an Abrasive Slurry and Methods for Chemical-Mechanical Polishing simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
  [[Category:B24B37/04]]
  4 KB (491 words) - 04:15, 18 October 2024
• 17966021. MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING simplified abstract (Intel Corporation)
  [[Category:B24B37/04]]
  3 KB (420 words) - 05:58, 26 April 2024
• Samsung electronics co., ltd. (20240278383). CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING METHOD simplified abstract
  [[Category:B24B37/04]]
  4 KB (573 words) - 05:50, 22 August 2024
• US Patent Application 18449942. Compositions and Foam Compositions Containing Composite Particles, Articles, Composite Particles, and Methods simplified abstract
  [[Category:B24B37/24]] [[Category:C08L31/04]]
  4 KB (547 words) - 05:10, 5 December 2023
• 18393077. POLISHING APPARATUS AND POLISHING METHOD simplified abstract (EBARA CORPORATION)
  [[Category:B24B49/04]] [[Category:B24B37/10]]
  4 KB (596 words) - 07:26, 28 June 2024
• 18383226. CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN AND METHOD OF POLISHING TUNGSTEN USING THE SAME simplified abstract (SAMSUNG SDI CO., LTD.)
  [[Category:B24B37/04]]
  4 KB (578 words) - 04:39, 6 June 2024
• 18085768. CHEMICAL MECHANICAL POLISHING OF METAL GATE CUTS FORMED AFTER SOURCE AND DRAIN CONTACTS simplified abstract (Intel Corporation)
  [[Category:B24B37/04]]
  6 KB (865 words) - 04:20, 28 June 2024
• DISCO CORPORATION Patent Application Trends in 2024
  * [[:Category:CPC_B24B37/245|B24B37/245]] ({Pads with fixed abrasives}) [[Category:CPC_B23Q5/04]]
  12 KB (1,512 words) - 07:47, 19 July 2024
• Intel corporation (20240213026). CHEMICAL MECHANICAL POLISHING OF METAL GATE CUTS FORMED AFTER SOURCE AND DRAIN CONTACTS simplified abstract
  [[Category:B24B37/04]]
  6 KB (837 words) - 00:37, 28 June 2024
• Applied Materials, Inc. patent applications on August 1st, 2024
  [[:Category:CPC_C30B25/14|C30B25/14]] (2), [[:Category:CPC_B24B37/32|B24B37/32]] (1), [[:Category:CPC_H01L21/0254|H01L21/0254]] (1), [[:Category:CPC_H0 IPC Code(s): B24B37/32, B24B37/005, B24B37/04
  36 KB (5,584 words) - 09:04, 5 August 2024
• Patent Applications Report for 13th Jan 2023
  ...ategory:H03K3/037|H03K3/037]] (4 applications), [[:Category:H02H9/04|H02H9/04]] (4 applications) ...tegory:H04L5/00|H04L5/00]] (11 applications), [[:Category:H04W72/04|H04W72/04]] (11 applications), [[:Category:H04W72/14|H04W72/14]] (8 applications)
  38 KB (4,677 words) - 01:14, 2 January 2024
• Category:Tetsuya KAMIMURA
  * [[:Category:CPC_C11D7/04|C11D7/04]] (DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR * [[:Category:CPC_B01D37/04|B01D37/04]] (SEPARATION (separating solids from solids by wet methods): 1 patents
  1 member (1 subcategory, 0 files) - 13:08, 21 July 2024
• Patent Applications Report for 10th Feb 2023
  IPC Code(s): G06N3/08, G06N3/04, G06K9/62, G06T5/50 IPC Code(s): G06T17/00, G06F30/27, G06N3/08, G06N3/04
  39 KB (4,888 words) - 04:21, 2 January 2024
• Patent Applications Report for 16th Jun 2023
  ...tegory:H04L5/00|H04L5/00]] (21 applications), [[:Category:H04W72/04|H04W72/04]] (14 applications), [[:Category:H04W72/0446|H04W72/0446]] (12 applications ...y:C07D405/14|C07D405/14]] (6 applications), [[:Category:C07D471/04|C07D471/04]] (4 applications), [[:Category:C07D403/12|C07D403/12]] (4 applications)
  37 KB (4,510 words) - 08:58, 4 January 2024
• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
  IPC Code(s): B08B3/02, B08B1/00, B08B5/02, B08B5/04, B24B7/22 ...egory:B08B3/02]][[Category:B08B1/00]][[Category:B08B5/02]][[Category:B08B5/04]][[Category:B24B7/22]][[Category:taiwan semiconductor manufacturing company
  83 KB (12,114 words) - 04:35, 20 February 2024
• Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
  IPC Code(s): B24B37/30, B24B37/04, H01L21/306, H01L21/67, H01L21/677 ...c platen during performance of cmp.[[Category:B24B37/30]][[Category:B24B37/04]][[Category:H01L21/306]][[Category:H01L21/67]][[Category:H01L21/677]][[Cate
  74 KB (11,025 words) - 02:57, 10 June 2024
• Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
  ...[[:Category:CPC_H01L21/0274|H01L21/0274]] (2), [[:Category:CPC_B24B37/005|B24B37/005]] (1), [[:Category:CPC_H01L27/0262|H01L27/0262]] (1) IPC Code(s): B24B37/005, B24B51/00, H01L21/67
  88 KB (13,079 words) - 16:49, 4 July 2024
• Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
  IPC Code(s): H01L21/321, B24B9/06, B24B37/04, B24B37/24, B24B37/26 ...[Category:B24B9/06]][[Category:B24B37/04]][[Category:B24B37/24]][[Category:B24B37/26]][[Category:CPC_H01L21/3212]][[Category:taiwan semiconductor manufacturi
  86 KB (12,527 words) - 03:30, 13 September 2024
• Samsung Display Co., LTD. patent applications on August 29th, 2024
  IPC Code(s): B32B37/10, B32B3/04 ...anel at the corner portions thereof.[[Category:B32B37/10]][[Category:B32B3/04]][[Category:CPC_B32B37/10]][[Category:samsung display co., ltd.]]
  79 KB (12,561 words) - 06:10, 2 September 2024
• TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
  IPC Code(s): B24B37/015, B24B37/24, B24B37/32, H01L21/321, H01L21/67 CPC Code(s): B24B37/015
  156 KB (23,262 words) - 07:01, 19 September 2024

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