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- 14:36, 29 December 2024 Intel corporation (20240429901). ULTRA-LOW CLOCK POWER MULTI-BIT FLIP-FLOPS USING UNIDIRECTIONAL DEVICES (hist) [1,794 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429888). VARIABLE GAIN AMPLIFIER WITH COMPLEMENTARILY SWITCHED NEUTRALIZED DIFFERENTIAL PAIR (hist) [1,442 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429816). ACTIVE BOOTSTRAPPED-SUPPLY GENERATOR (hist) [1,467 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429865). TECHNIQUES FOR RESONANT ROTARY CLOCKING FOR DIE-TO-DIE COMMUNICATION (hist) [2,024 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429588). MILLIMETER-WAVE DIELECTRIC WAVEGUIDE BUNDLE INCLUDING FIRST AND SECOND ADJACENT DIELECTRIC WAVEGUIDES HAVING DIFFERENT CORE AND/OR CLADDING MATERIALS (hist) [1,973 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429301). PEROVSKITE-BASED FIELD EFFECT TRANSISTOR (FET) DEVICES ENABLED BY EPITAXIAL LATERAL OVERGROWTH (hist) [3,512 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429294). INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE PLUG LAST APPROACH (hist) [1,563 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429291). INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE SOURCE OR DRAIN CONTACT SELECTIVITY (hist) [2,122 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429276). FORKSHEET DEVICES WITH DIELECTRIC SPINE AT CELL BOUNDARY (hist) [1,920 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429269). INTEGRATED CAPACITOR (hist) [1,841 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429235). COMPLEMENTARY FIELD-EFFECT TRANSISTOR WITH FORKED SEMICONDUCTOR STRUCTURE (hist) [2,160 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429238). FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADDITIVE METAL GATES (hist) [2,267 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429221). GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES (hist) [2,020 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429225). ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT FOR DIE-TO-DIE INPUT/OUTPUT SIGNALS (hist) [1,357 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429199). METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BONDING (hist) [2,216 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429173). MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME (hist) [2,298 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429164). INTEGRATED CIRCUIT DEVICES WITH FLIPPED STAIRCASE INTERCONNECT STRUCTURES (hist) [1,497 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429162). INTEGRATED CIRCUIT DEVICES WITH CONDUCTIVE LINES EXTENDING OVER SCRIBE LINES (hist) [2,055 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429155). INTEGRATED CAPACITOR (hist) [1,842 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 14:36, 29 December 2024 Intel corporation (20240429161). STAGGERED VIA ARCHITECTURE ACROSS UNIT CELLS (hist) [2,386 bytes] Wikipatents (talk | contribs) (Creating a new page)
