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- 01:42, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379592). Transmission Line Structures for Three-Dimensional Integrated Circuit and the Methods Thereof simplified abstract (hist) [4,119 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:42, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379588). GUARD RING STRUCTURE simplified abstract (hist) [3,712 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:42, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379587). SEAL RING REINFORCEMENT simplified abstract (hist) [3,242 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:42, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379586). GUARD RING AND MANUFACTURING METHOD THEREOF simplified abstract (hist) [4,084 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:42, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379584). SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME simplified abstract (hist) [5,015 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:42, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379581). ELECTROMAGNETIC SHIELDING STRUCTURE FOR A SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME simplified abstract (hist) [3,294 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:42, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379577). CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (hist) [3,665 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:42, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379570). SUBSTRATE LOSS REDUCTION FOR SEMICONDUCTOR DEVICES simplified abstract (hist) [4,070 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:42, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379569). MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (hist) [3,770 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:42, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379565). INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (hist) [4,334 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:42, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379563). REDUCING RC DELAY IN SEMICONDUCTOR DEVICES simplified abstract (hist) [4,185 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:42, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379560). SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (hist) [4,572 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:41, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379559). GRAPHENE-ASSISTED LOW-RESISTANCE INTERCONNECT STRUCTURES AND METHODS OF FORMATION THEREOF simplified abstract (hist) [4,958 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:41, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379558). INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (hist) [3,809 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:41, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379557). CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS simplified abstract (hist) [3,918 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:41, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379556). Forming Liners to Facilitate The Formation of Copper-Containing Vias in Advanced Technology Nodes simplified abstract (hist) [4,284 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:41, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379554). BACK SIDE SIGNAL ROUTING IN A CIRCUIT WITH A RELAY CELL simplified abstract (hist) [4,435 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:41, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379552). LAYOUTS FOR CONDUCTIVE LAYERS IN INTEGRATED CIRCUITS simplified abstract (hist) [4,228 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:41, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379551). Semiconductor Device with Backside Power Rail and Method for Forming the Same simplified abstract (hist) [3,865 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:41, 25 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379548). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract (hist) [3,521 bytes] Wikipatents (talk | contribs) (Creating a new page)
