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- 06:53, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379425). CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME simplified abstract (hist) [3,837 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:53, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379423). BARRIER LAYER FOR AN INTERCONNECT STRUCTURE simplified abstract (hist) [4,643 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:53, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379422). FIELD EFFECT TRANSISTOR WITH MULTI-METAL GATE VIA AND METHOD simplified abstract (hist) [3,669 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:53, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379419). SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED simplified abstract (hist) [3,521 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:53, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379417). INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (hist) [4,903 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:53, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379416). SEMICONDUCTOR DEVICE HAVING THERMALLY CONDUCTIVE AIR GAP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (hist) [5,007 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:53, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379414). AIR SPACER SURROUNDING CONDUCTIVE FEATURES AND METHOD FORMING SAME simplified abstract (hist) [4,140 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:53, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379413). INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (hist) [4,541 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:53, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379412). HOMOGENEOUS SOURCE/DRAIN CONTACT STRUCTURE simplified abstract (hist) [3,793 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:53, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379408). SOURCE/DRAIN ISOLATION STRUCTURE AND METHODS THEREOF simplified abstract (hist) [3,919 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:53, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379407). TRENCH FILLING THROUGH REFLOWING FILLING MATERIAL simplified abstract (hist) [4,293 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:53, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379404). APPARATUS AND METHOD FOR SUBSTRATE HANDLING simplified abstract (hist) [4,272 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:52, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379401). SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract (hist) [4,187 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:52, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379400). WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPERATURE UNIFORMITY simplified abstract (hist) [4,165 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:52, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379398). SEMICONDUCTOR PROCESSING TOOL AND METHOD OF OPERATION simplified abstract (hist) [4,383 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:52, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379394). SEMICONDUCTOR SUBSTRATE BOAT AND METHODS OF USING THE SAME simplified abstract (hist) [3,646 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:52, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379393). INTEGRATED SEMICONDUCTOR DIE VESSEL PROCESSING WORKSTATIONS simplified abstract (hist) [3,533 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:52, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379391). AIRFLOW DETECTION DEVICE AND METHODS OF USE simplified abstract (hist) [4,007 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:52, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379387). SMALL GAS FLOW MONITORING OF DRY ETCHER BY OES SIGNAL simplified abstract (hist) [3,674 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:52, 21 November 2024 Taiwan semiconductor manufacturing company, ltd. (20240379381). PERFORMING ANNEALING PROCESS TO IMPROVE FIN QUALITY OF A FINFET SEMICONDUCTOR simplified abstract (hist) [3,587 bytes] Wikipatents (talk | contribs) (Creating a new page)
