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- 05:51, 25 October 2024 Intel corporation (20240356799). METHODS AND APPARATUS TO MANAGE CONFIGURATION ASSETS FOR NETWORK DEVICES simplified abstract (hist) [4,136 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:51, 25 October 2024 Intel corporation (20240356739). RANGE CONSTRAINED DEVICE CONFIGURATION simplified abstract (hist) [4,010 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:51, 25 October 2024 Intel corporation (20240356552). LOW CONTENTION CURRENT CIRCUITS simplified abstract (hist) [3,251 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:51, 25 October 2024 Intel corporation (20240356198). INTEGRATED CIRCUIT PACKAGES, ANTENNA MODULES, AND COMMUNICATION DEVICES simplified abstract (hist) [2,451 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:51, 25 October 2024 Intel corporation (20240355980). PHOTONIC INTEGRATED CIRCUIT PACKAGES WITH SCALABLE HETEROGENEOUS INTEGRATION simplified abstract (hist) [3,795 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:51, 25 October 2024 Intel corporation (20240355934). INTEGRATED CIRCUITS WITH MONOLAYER TMD CHANNEL AND MULTILAYER TMD SOURCE AND DRAIN simplified abstract (hist) [4,144 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:51, 25 October 2024 Intel corporation (20240355915). BACKSIDE CONDUCTIVE STRUCTURES EXTENDING THROUGH INTEGRATED CIRCUIT TO MEET FRONTSIDE CONTACTS simplified abstract (hist) [4,726 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:51, 25 October 2024 Intel corporation (20240355903). SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH GATE-ALL-AROUND DEVICES ABOVE INSULATOR SUBSTRATES simplified abstract (hist) [3,918 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:51, 25 October 2024 Intel corporation (20240355891). CONDUCTIVE BRIDGE THROUGH DIELECTRIC WALL BETWEEN SOURCE OR DRAIN CONTACTS simplified abstract (hist) [4,344 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:51, 25 October 2024 Intel corporation (20240355890). CONDUCTIVE BRIDGE THROUGH DIELECTRIC WALL BETWEEN SOURCE OR DRAIN CONTACTS simplified abstract (hist) [4,352 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:51, 25 October 2024 Intel corporation (20240355876). NANORIBBON-BASED TRANSISTOR WITH UNIFORM OXIDE simplified abstract (hist) [3,588 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:51, 25 October 2024 Intel corporation (20240355819). INTEGRATED CIRCUIT STRUCTURE WITH FRONT SIDE SIGNAL LINES AND BACKSIDE POWER DELIVERY simplified abstract (hist) [4,288 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:50, 25 October 2024 Intel corporation (20240355792). REVERSED OVERHANG MEMORY ON PACKAGE (MOP) ARCHITECTURE simplified abstract (hist) [3,948 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:50, 25 October 2024 Intel corporation (20240355778). EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESSORS FOR DIE TO PLATFORM AND DIE-DIE RF NOISE SUPPRESSION simplified abstract (hist) [3,496 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:50, 25 October 2024 Intel corporation (20240355768). MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS simplified abstract (hist) [4,247 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:50, 25 October 2024 Intel corporation (20240355759). LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DAMAGE simplified abstract (hist) [4,109 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:50, 25 October 2024 Intel corporation (20240355758). METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIATED INTEGRATED CIRCUIT PACKAGES HAVING GLASS CORES simplified abstract (hist) [5,068 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:50, 25 October 2024 Intel corporation (20240355752). GLASS PACKAGE SUBSTRATE WITH CHIP DISAGGREGATION INTERFACE simplified abstract (hist) [2,734 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:50, 25 October 2024 Intel corporation (20240355751). SELECTIVE UNDERCUT FOR GLASS CORE SUBSTRATE BRIDGE FIRST LEVEL INTERCONNECT (FLI) BUMP PLATING simplified abstract (hist) [3,651 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:50, 25 October 2024 Intel corporation (20240355750). MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS simplified abstract (hist) [3,364 bytes] Wikipatents (talk | contribs) (Creating a new page)
