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- 04:19, 18 October 2024 18746148. Automated Model Generation Platform for Recursive Model Building simplified abstract (Bank of America Corporation) (hist) [4,310 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:19, 18 October 2024 18754172. METHOD OF FORMING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (hist) [4,163 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:19, 18 October 2024 18131434. SYSTEMS, METHODS, AND APPARATUSES FOR GENERATING A DIGITAL TWIN OF A RESOURCE USING PARTIAL SENSOR DATA AND ARTIFICIAL INTELLIGENCE simplified abstract (Bank of America Corporation) (hist) [4,565 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:19, 18 October 2024 18751336. MEMORY DEVICES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (hist) [3,363 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:19, 18 October 2024 18131757. SYSTEM FOR COMPONENT-LEVEL THREAT ASSESSMENT IN A COMPUTING ENVIRONMENT simplified abstract (Bank of America Corporation) (hist) [3,995 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:19, 18 October 2024 18131063. SYSTEM FOR IMPLEMENTING A CODE DEBUGGER PLATFORM IN A VIRTUAL ENVIRONMENT simplified abstract (Bank of America Corporation) (hist) [4,797 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:19, 18 October 2024 18750097. ELECTROSTATIC DISCHARGE CIRCUIT AND METHOD OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (hist) [3,202 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:19, 18 October 2024 18745043. Managing and Routing Messages to Distributed User Devices in an Enterprise Computing Environment simplified abstract (Bank of America Corporation) (hist) [4,699 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:19, 18 October 2024 18749516. PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (hist) [4,353 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:19, 18 October 2024 18131778. SYSTEM AND METHOD FOR PROVIDING MAINFRAME RESOURCE UTILIZATION FOR BATCH CYCLE APPLICATION INTEGRATION simplified abstract (Bank of America Corporation) (hist) [4,510 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:19, 18 October 2024 18753744. Semiconductor Device with Multi-Layer Dielectric and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (hist) [4,614 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:19, 18 October 2024 18746126. ARTIFICIAL INTELLIGENCE (AI) SUPPORTED GRAPH ENABLED METHOD TO MANAGE UPGRADES FOR APPLICATIONS simplified abstract (Bank of America Corporation) (hist) [4,777 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:19, 18 October 2024 18751362. METHOD OF FORMING SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (hist) [3,008 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:19, 18 October 2024 18753091. CHIP PACKAGE HAVING MULTIPLE CHIPS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (hist) [5,182 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:18, 18 October 2024 SAMSUNG SDI CO., LTD. patent applications published on October 10th, 2024 (hist) [4,118 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:18, 18 October 2024 18540023. DEVICE AND METHOD FOR CONTROLLING CHARGING OF BATTERY PACK simplified abstract (SAMSUNG SDI CO., LTD.) (hist) [3,418 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:18, 18 October 2024 18754753. HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (hist) [3,650 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:18, 18 October 2024 18749219. SECONDARY BATTERY simplified abstract (SAMSUNG SDI CO., LTD.) (hist) [2,770 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:18, 18 October 2024 18751724. CHIP PACKAGE STRUCTURE WITH LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) (hist) [4,607 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:18, 18 October 2024 18491715. BATTERY MODULE simplified abstract (SAMSUNG SDI CO., LTD.) (hist) [3,357 bytes] Wikipatents (talk | contribs) (Creating a new page)
