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- 01:38, 18 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240347489). MEMORY DEVICES simplified abstract (hist) [3,144 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 18531266. METHODS AND SYSTEMS FOR VERIFYING INTEGRATED CIRCUITS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) (hist) [3,628 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240347488). CHIP STRUCTURE WITH CONDUCTIVE LAYER simplified abstract (hist) [3,754 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 18749186. REFRIGERATOR AND CONTROL METHOD THEREFOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) (hist) [3,892 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240347483). ELECTROSTATIC DISCHARGE CIRCUIT AND METHOD OF FORMING THE SAME simplified abstract (hist) [3,626 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 18746985. REFRIGERATOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) (hist) [3,529 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240347467). PACKAGE STRUCTURE simplified abstract (hist) [5,302 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 18746597. AIR CONDITIONER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) (hist) [4,320 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 18746641. MONITORING DEVICE FOR ENVIRONMENTAL IMPROVEMENT, AND CONTROL METHOD THEREFOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) (hist) [3,380 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240347463). Semiconductor Device with Multi-Layer Dielectric and Methods of Forming the Same simplified abstract (hist) [4,981 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 18744262. AIR CONDITIONING DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) (hist) [4,126 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240347447). METHOD OF FORMING SEMICONDUCTOR PACKAGE simplified abstract (hist) [3,308 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 18746956. VACUUM CLEANER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) (hist) [2,640 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240347439). CHIP PACKAGE HAVING MULTIPLE CHIPS simplified abstract (hist) [5,230 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 18734244. WASHING MACHINE AND CONTROLLING METHOD SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) (hist) [3,766 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 18620906. QUANTUM DOT COMPOSITION, METHOD OF PREPARING THE SAME, CURED PRODUCT THEREOF, AND DISPLAY DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) (hist) [3,981 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240347412). HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract (hist) [3,886 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 18747069. MOTION ASSIST DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) (hist) [3,959 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:38, 18 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240347410). CHIP PACKAGE STRUCTURE WITH LID simplified abstract (hist) [3,902 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 01:37, 18 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240347407). METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS simplified abstract (hist) [4,869 bytes] Wikipatents (talk | contribs) (Creating a new page)