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- 00:01, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339511). SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND BACKSIDE SELF-ALIGNED VIA simplified abstract (hist) [4,021 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:01, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339510). SEMICONDUCTOR DEVICE STRUCTURE WITH BACKSIDE CONTACT simplified abstract (hist) [4,179 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:01, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339508). BIPOLAR JUNCTION TRANSISTOR WITH GATE OVER TERMINALS simplified abstract (hist) [3,302 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:01, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339497). Dual Side Contact Structures in Semiconductor Devices simplified abstract (hist) [4,629 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:01, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339475). SIGNAL SHIELDING FOR INTEGRATED CIRCUITS simplified abstract (hist) [4,359 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:01, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339467). ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY simplified abstract (hist) [4,942 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339456). INPUT/OUTPUT SEMICONDUCTOR DEVICES simplified abstract (hist) [4,192 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339455). SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (hist) [3,802 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339449). INTEGRATED CIRCUIT STRUCTURE WITH A REDUCED AMOUNT OF DEFECTS AND METHODS FOR FABRICATING THE SAME simplified abstract (hist) [4,547 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339448). NOVEL THIN FILM RESISTOR simplified abstract (hist) [2,818 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339446). EMBEDDED CLAMPING DIODE TO IMPROVE DEVICE RUGGEDNESS simplified abstract (hist) [3,424 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339432). JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (hist) [3,795 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339427). MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREOF simplified abstract (hist) [4,597 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339424). MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW simplified abstract (hist) [3,670 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339422). SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION simplified abstract (hist) [4,080 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339415). PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract (hist) [3,611 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339408). Semiconductor Package and Method simplified abstract (hist) [3,973 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 23:59, 13 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339406). INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH AIR GAPS simplified abstract (hist) [4,532 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 23:59, 13 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339396). SELF-ALIGNED VIA STRUCTURES AND METHODS simplified abstract (hist) [3,450 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 23:59, 13 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339369). STRUCTURE AND FORMATION METHOD OF PACKAGE STRUCTURE WITH CAPACITOR simplified abstract (hist) [3,479 bytes] Wikipatents (talk | contribs) (Creating a new page)