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- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339455). SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (hist) [3,802 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339449). INTEGRATED CIRCUIT STRUCTURE WITH A REDUCED AMOUNT OF DEFECTS AND METHODS FOR FABRICATING THE SAME simplified abstract (hist) [4,547 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339448). NOVEL THIN FILM RESISTOR simplified abstract (hist) [2,818 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339446). EMBEDDED CLAMPING DIODE TO IMPROVE DEVICE RUGGEDNESS simplified abstract (hist) [3,424 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339432). JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (hist) [3,795 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339427). MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREOF simplified abstract (hist) [4,597 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339424). MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW simplified abstract (hist) [3,670 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339422). SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION simplified abstract (hist) [4,080 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339415). PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract (hist) [3,611 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 00:00, 14 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339408). Semiconductor Package and Method simplified abstract (hist) [3,973 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 23:59, 13 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339406). INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH AIR GAPS simplified abstract (hist) [4,532 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 23:59, 13 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339396). SELF-ALIGNED VIA STRUCTURES AND METHODS simplified abstract (hist) [3,450 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 23:59, 13 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339369). STRUCTURE AND FORMATION METHOD OF PACKAGE STRUCTURE WITH CAPACITOR simplified abstract (hist) [3,479 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 23:59, 13 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339362). MULTI-GATE DEVICES WITH IMPROVED PERFORMANCE AND METHODS OF FABRICATING THE SAME simplified abstract (hist) [3,978 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 23:59, 13 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339356). INSULATING CAP ON CONTACT STRUCTURE simplified abstract (hist) [3,843 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 23:59, 13 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339355). Air-Replaced Spacer for Self-Aligned Contact Scheme simplified abstract (hist) [3,997 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 23:59, 13 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339348). PICK-AND-PLACE SYSTEM WITH A STABILIZER simplified abstract (hist) [3,276 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 23:59, 13 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339344). SYSTEMS AND METHODS FOR INSPECTION STATIONS simplified abstract (hist) [4,148 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 23:59, 13 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339329). GAS PHASE TREATMENT FOR MANUFACTURING SEMICONDUCTOR STRUCTURE simplified abstract (hist) [4,723 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 23:59, 13 October 2024 Taiwan semiconductor manufacturing company, ltd. (20240339327). METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY simplified abstract (hist) [3,674 bytes] Wikipatents (talk | contribs) (Creating a new page)