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- 15:39, 4 October 2024 Intel corporation (20240332251). DUMMY SILICON STIFFENING MECHANISM FOR MODULE WARPAGE MITIGATION simplified abstract (hist) [3,344 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:39, 4 October 2024 Intel corporation (20240332237). MICROELECTRONIC ASSEMBLIES WITH DIRECT BONDING USING NANOTWINNED COPPER simplified abstract (hist) [3,795 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:39, 4 October 2024 Intel corporation (20240332222). CONFIGURABLE SEMICONDUCTOR PACKAGE CAPACITORS AND METHOD simplified abstract (hist) [3,134 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:39, 4 October 2024 Intel corporation (20240332203). MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER simplified abstract (hist) [4,428 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:39, 4 October 2024 Intel corporation (20240332195). SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE TSV BRIDGE FOR GLASS CORE PACKAGES simplified abstract (hist) [3,573 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332193). INTERCONNECT BRIDGE CIRCUITRY DESIGNS FOR INTEGRATED CIRCUIT PACKAGE SUBSTRATES simplified abstract (hist) [3,770 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332175). BACKSIDE TRANSISTOR CONTACT SURROUNDED BY OXIDE simplified abstract (hist) [3,758 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332172). INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE CONTACT WIDENING simplified abstract (hist) [4,940 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332166). INTEGRATED CIRCUIT STRUCTURES HAVING AIR GAPS simplified abstract (hist) [4,547 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332155). SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS simplified abstract (hist) [2,923 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332153). DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION simplified abstract (hist) [2,573 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332134). METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CIRCUIT PACKAGES simplified abstract (hist) [3,487 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:38, 4 October 2024 Intel corporation (20240332127). ON-PACKAGE EMBEDDED COOLING DEVICE simplified abstract (hist) [2,937 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332126). THERMAL GROUNDING IN BACKSIDE POWER SCHEMES USING CARRIER WAFERS simplified abstract (hist) [4,989 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332125). 2D FILLERS FOR REDUCED CTE FOR PID simplified abstract (hist) [3,764 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332116). SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD simplified abstract (hist) [2,855 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332112). CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL simplified abstract (hist) [4,458 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332100). GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES simplified abstract (hist) [4,080 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332088). MODULATION OF CHIP PERFORMANCE BY CONTROLLING TRANSISTOR GATE PROFILE simplified abstract (hist) [4,041 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 15:37, 4 October 2024 Intel corporation (20240332077). INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE GATE CONNECTION simplified abstract (hist) [3,837 bytes] Wikipatents (talk | contribs) (Creating a new page)
