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- 06:31, 27 September 2024 Qualcomm incorporated (20240322819). FINE GRAIN POWER GATING simplified abstract (hist) [4,412 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:31, 27 September 2024 Qualcomm incorporated (20240322795). TRANSMIT (TX) RECEIVE (RX) PHASED ARRAY SYSTEM simplified abstract (hist) [4,095 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:31, 27 September 2024 Qualcomm incorporated (20240322794). CURRENT-MODE FILTER simplified abstract (hist) [2,972 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:31, 27 September 2024 Qualcomm incorporated (20240322791). MONOLITHIC-INTEGRATED BULK ACOUSTIC WAVE (BAW) RESONATOR simplified abstract (hist) [3,729 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:31, 27 September 2024 Qualcomm incorporated (20240322768). ANTENNA TUNER simplified abstract (hist) [3,279 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:30, 27 September 2024 Qualcomm incorporated (20240322686). SWITCHING SCHEME FOR OPERATING A THREE-LEVEL BUCK CONVERTER IN A TWO-LEVEL BUCK CONVERTER MODE simplified abstract (hist) [3,432 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:30, 27 September 2024 Qualcomm incorporated (20240322685). POWER SUPPLY CIRCUIT WITH MULTIPLE MODES simplified abstract (hist) [4,020 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:30, 27 September 2024 Qualcomm incorporated (20240322562). BATTERY HOT SWAPPING simplified abstract (hist) [3,838 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:30, 27 September 2024 Qualcomm incorporated (20240322417). RADIO FREQUENCY OSCILLATOR WITH CERAMIC RESONATOR AND SURFACE-MOUNTED INTEGRATED CIRCUIT PACKAGE simplified abstract (hist) [4,186 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:30, 27 September 2024 Qualcomm incorporated (20240321965). SELECTIVE CONTACT ON SOURCE AND DRAIN simplified abstract (hist) [3,536 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:30, 27 September 2024 Qualcomm incorporated (20240321936). INTEGRATED DEVICE COMPRISING AN INDUCTOR AND A PATTERNED SHIELD STRUCTURE simplified abstract (hist) [3,249 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:30, 27 September 2024 Qualcomm incorporated (20240321861). LOGIC CIRCUITS INCLUDING CIRCUITS OF DIFFERENT HEIGHTS AND RELATED METHOD OF FABRICATION simplified abstract (hist) [4,110 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:30, 27 September 2024 Qualcomm incorporated (20240321860). ROW CELL CIRCUITS WITH ABRUPT DIFFUSION REGION WIDTH TRANSITIONS simplified abstract (hist) [4,585 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:30, 27 September 2024 Qualcomm incorporated (20240321849). PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE simplified abstract (hist) [3,701 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:30, 27 September 2024 Qualcomm incorporated (20240321763). PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS simplified abstract (hist) [3,717 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:30, 27 September 2024 Qualcomm incorporated (20240321752). PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE simplified abstract (hist) [4,050 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:30, 27 September 2024 Qualcomm incorporated (20240321730). INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUAL INDUCTANCE simplified abstract (hist) [3,609 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:29, 27 September 2024 Qualcomm incorporated (20240321729). INTEGRATED REDISTRIBUTION LAYER INDUCTORS simplified abstract (hist) [2,656 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:29, 27 September 2024 Qualcomm incorporated (20240321724). METAL-INSULATOR-METAL (MIM) CAPACITOR INTERCONNECT FOR HIGH-QUALITY (Q) INDUCTOR-CAPACITOR (LC) FILTER simplified abstract (hist) [3,663 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:29, 27 September 2024 Qualcomm incorporated (20240321709). PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION WITH VARIABLE THICKNESS METALLIZATION INTERCONNECTS ON A SAME METAL LAYER simplified abstract (hist) [4,337 bytes] Wikipatents (talk | contribs) (Creating a new page)
