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- 05:19, 27 September 2024 Samsung electronics co., ltd. (20240321679). HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (hist) [3,042 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:19, 27 September 2024 Samsung electronics co., ltd. (20240321673). SEMICONDUCTOR PACKAGE simplified abstract (hist) [3,542 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:19, 27 September 2024 Samsung electronics co., ltd. (20240321669). SEMICONDUCTOR PACKAGE simplified abstract (hist) [4,227 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:19, 27 September 2024 Samsung electronics co., ltd. (20240321667). SEMICONDUCTOR PACKAGE simplified abstract (hist) [4,533 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:18, 27 September 2024 Samsung electronics co., ltd. (20240321666). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE simplified abstract (hist) [3,775 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:18, 27 September 2024 Samsung electronics co., ltd. (20240321622). ADSORPTION DEVICE FOR REFLOW PROCESS AND METHOD OF ATTACHING CONNECTION BUMP USING THE SAME, AND VACUUM JIG FOR SEMICONDUCTOR PACKAGE simplified abstract (hist) [3,761 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:18, 27 September 2024 Samsung electronics co., ltd. (20240321619). SUBSTRATE SUPPORTER simplified abstract (hist) [4,559 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:18, 27 September 2024 Samsung electronics co., ltd. (20240321618). SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE ALIGNMENT METHOD simplified abstract (hist) [3,832 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:18, 27 September 2024 Samsung electronics co., ltd. (20240321599). CHEMICAL SUPPLY APPARATUS, SEMICONDUCTOR FABRICATION SYSTEM INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (hist) [4,287 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:18, 27 September 2024 Samsung electronics co., ltd. (20240321580). PHOTOMASK MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME simplified abstract (hist) [3,995 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:18, 27 September 2024 Samsung electronics co., ltd. (20240321557). APPARATUS FOR AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (hist) [3,838 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:18, 27 September 2024 Samsung electronics co., ltd. (20240321483). WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE WIRE CAPACITOR simplified abstract (hist) [2,650 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:18, 27 September 2024 Samsung electronics co., ltd. (20240321381). MEMORY DEVICE FOR CONTROLLING A DATA OUTPUT ORDER AND AN OPERATING METHOD THEREOF simplified abstract (hist) [3,133 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:18, 27 September 2024 Samsung electronics co., ltd. (20240321366). NONVOLATILE MEMORY DEVICE, STORAGE DEVICE INCLUDING NONVOLATILE MEMORY DEVICE, AND OPERATING METHOD OF STORAGE DEVICE simplified abstract (hist) [4,030 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:18, 27 September 2024 Samsung electronics co., ltd. (20240321361). MEMORY DEVICE WITH IMPROVED PROGRAM PERFORMANCE AND METHOD OF OPERATING THE SAME simplified abstract (hist) [4,098 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:18, 27 September 2024 Samsung electronics co., ltd. (20240321344). SRAM DEVICE INCLUDING BURIED BIT LINE AND BURIED WORD LINE USING BACKSIDE METAL simplified abstract (hist) [3,663 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:18, 27 September 2024 Samsung electronics co., ltd. (20240321338). COMPUTING SYSTEM PERFORMING DUTY CYCLE ADJUSTER TRAINING AND DUTY CYCLE ADJUSTER TRAINING METHOD THEREOF simplified abstract (hist) [4,251 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:17, 27 September 2024 Samsung electronics co., ltd. (20240321333). MAGNETIC TUNNELING JUNCTION DEVICE CAPABLE OF MAGNETIC SWITCHING WITHOUT EXTERNAL MAGNETIC FIELD AND MEMORY DEVICE INCLUDING THE SAME simplified abstract (hist) [4,026 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:17, 27 September 2024 Samsung electronics co., ltd. (20240321330). STORAGE DEVICE INCLUDING BUFFER CHIP AND METHOD FOR PER-PIN TRAINING USING BUFFER CHIP simplified abstract (hist) [3,987 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:17, 27 September 2024 Samsung electronics co., ltd. (20240321324). MEMORY DEVICE INCLUDING VOLTAGE AND TEMPERATURE SENSING CIRCUIT AND METHOD FOR MANAGING OPERATION THEREOF simplified abstract (hist) [4,549 bytes] Wikipatents (talk | contribs) (Creating a new page)
