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- 08:22, 26 September 2024 Intel corporation (20240323711). GOOD CELL QUALITY CRITERIA simplified abstract (hist) [3,956 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:22, 26 September 2024 Intel corporation (20240323657). MISBEHAVIOR DETECTION USING DATA CONSISTENCY CHECKS FOR COLLECTIVE PERCEPTION MESSAGES simplified abstract (hist) [4,045 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:22, 26 September 2024 Intel corporation (20240323422). SUB-PICTURES AND SUB-PICTURE SETS WITH LEVEL DERIVATION simplified abstract (hist) [3,529 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:22, 26 September 2024 Intel corporation (20240323341). APPARATUS AND METHOD FOR FOVEATED STEREO RENDERING simplified abstract (hist) [3,593 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:21, 26 September 2024 Intel corporation (20240322948). ENHANCED ACKNOWLEDGMENT IN RESPONSE TO WIRELESS TRANSMISSIONS simplified abstract (hist) [3,021 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:21, 26 September 2024 Intel corporation (20240322947). ENHANCED PHYSICAL UPLINK SHARED CHANNEL REPETITION FOR HALF DUPLEX FREQUENCY DIVISION DUPLEX WIRELESS OPERATIONS simplified abstract (hist) [3,533 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:21, 26 September 2024 Intel corporation (20240322775). THREE-DIMENSIONAL POWER COMBINERS simplified abstract (hist) [4,391 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:21, 26 September 2024 Intel corporation (20240321987). LONG CHANNEL FIN TRANSISTORS IN NANORIBBON-BASED DEVICES simplified abstract (hist) [3,730 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:21, 26 September 2024 Intel corporation (20240321978). CONTACT EXTENDED OVER AN ADJACENT SOURCE OR DRAIN REGION simplified abstract (hist) [4,480 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:21, 26 September 2024 Intel corporation (20240321962). ROUNDED NANORIBBONS WITH REGROWN CAPS simplified abstract (hist) [3,892 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:21, 26 September 2024 Intel corporation (20240321892). CONSTRAINED EPITAXIAL FORMATION USING DIELECTRIC WALLS simplified abstract (hist) [4,219 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:21, 26 September 2024 Intel corporation (20240321887). INTEGRATED CIRCUIT DEVICE WITH REDUCED N-P BOUNDARY EFFECT simplified abstract (hist) [5,115 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:21, 26 September 2024 Intel corporation (20240321872). GATE LINK ACROSS GATE CUT IN SEMICONDUCTOR DEVICES simplified abstract (hist) [5,404 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:21, 26 September 2024 Intel corporation (20240321859). INTEGRATED CIRCUIT DEVICE WITH PERFORMANCE-ENHANCING LAYOUT simplified abstract (hist) [5,322 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:20, 26 September 2024 Intel corporation (20240321807). BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PACKAGES WITH RESTRICTED UNDERFILL AREAS simplified abstract (hist) [4,571 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:20, 26 September 2024 Intel corporation (20240321785). CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE simplified abstract (hist) [2,955 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:20, 26 September 2024 Intel corporation (20240321762). HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract (hist) [4,729 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:20, 26 September 2024 Intel corporation (20240321754). INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH ENCAPSULATED GLASS CORES simplified abstract (hist) [3,063 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:20, 26 September 2024 Intel corporation (20240321738). BRIDGING CONTACT STRUCTURES simplified abstract (hist) [4,730 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 08:20, 26 September 2024 Intel corporation (20240321737). ISOLATED BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES simplified abstract (hist) [3,711 bytes] Wikipatents (talk | contribs) (Creating a new page)
